Used TEL / TOKYO ELECTRON TE 8401 #9161274 for sale

TEL / TOKYO ELECTRON TE 8401
ID: 9161274
Dry etcher.
TEL / TOKYO ELECTRON TE 8401 is a plasma etching approach used for multiple semiconductor procedures in microelectronics manufacturing. The etcher is an advanced tool designed for precision dry etching for challenging applications on compound materials. Its automated control interface and easy-to-use process control equipment enables reliable etching processes. The unique self-adjusting power supply technology of TEL TE 8401 allows it to deliver precise high speed etching with higher throughput and excellent repeatability. The etcher is equipped with an advanced high-speed loadlock to keep effective process control, which ensures minimal wear and tear. The high-speed transport wafer manipulation unit is also designed for fast and smooth wafer movement between the loadlock and process chamber. TOKYO ELECTRON TE-8401's advanced plasma source enables independent control over the etch depth, profile, material removal rate, and feature minutiae to prevent over-etching. It has wide-range etching capabilities and can etch various dielectric and polysilicon materials, copper layers, or insulators for a vast range of semiconductor devices. This high-performing tool can provide extremely clean etch surfaces and ultra-high resolution designs at a high speed and with minimal process by-products. TOKYO ELECTRON TE 8401 includes an integrated control system and communications protocol to manage up to sixteen separate etching processes. It has a multi-profile etching capability where both depth and time etching can be performed with the highest accuracy available and without manual intervention. It also has an embedded diagnostics unit to ensure consistent etch performance and monitor any potential hardware faults, minimizing downtime. TEL TE-8401 etcher has a number of safety features including a pressure interlock to prevent pressure buildup during operation, and an inert gas flow monitor to ensure that the chamber is at least slightly pressurized to quickly block out any process related contamination. The control machine of the etcher also ensures that the tool does not start until the appropriate cooling asset is in place and ready.
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