Used TEL / TOKYO ELECTRON TE 8500 #9192932 for sale

TEL / TOKYO ELECTRON TE 8500 is a state-of-the-art plasma etching equipment designed to provide precise and accurate etching results for wafer-level production. This plasma etcher features multiple chambers, an advanced process control and automation interface for easy setup and remote control and a solid ring-style motor to drive the wafer stage. The system offers excellent flexibility for process control and supports both single-wafer and multiple-wafer processing. This model features a linear and radial etching unit with a 4-sided, boron nitride-coated chamber that provides superior thermal conductivity and uniformity. The motorized wafer stage enables uniform etching of up to 14 wafers at once. The controllable process parameters, such as gas flow rates and chuck power, are monitored and analyzed in real-time to ensure a precise etching environment and the optimal etching results. The machine can also be equipped with special features, such as an adjustable etch rate and a maximum width detection. TEL TE 8500 offers the user a variety of etching options, including wet, dry, alkyl, radicals, fluorine, chlorine and boron. The process exigencies, such as pressure, temperature, species concentration, gas flow rates, and etch rates, can be tuned to achieve the best etching results. The tool also utilizes a temperature-controlled substrate chuck to prevent the wafer from overheating. Equipped with the latest process control and monitoring features, TOKYO ELECTRON TE 8500 provides maximum etching accuracy and repeatability. The manual process settings can be stored and recalled making for an easy setup process. Moreover, the asset is designed to be compliant with the latest industry regulations and safety guidelines. TE 8500 is a powerful plasma etching tool for wafer-level production. Its advanced features guarantee excellent etching results, uniformity, and precise process control. With state-of-the-art features like temperature control, species concentration, gas flow rates and wafer stage motion control, it is an ideal etching solution for high-volume, production-oriented applications.