Used TEL / TOKYO ELECTRON TE 8500 #9235829 for sale

TEL / TOKYO ELECTRON TE 8500
ID: 9235829
Wafer Size: 8"
Vintage: 1994
Etcher, 8" 1994 vintage.
TEL / TOKYO ELECTRON TE 8500 is an etcher/asher, a device used in semiconductor device fabrication, that deposits and removes material to and from the wafer surface through the process of etching, allowing for a greater level of precision compared to manual methods. TEL TE 8500 in particular is a multifunctional tool that can be used in a variety of processes, from simple etching to complex sequential etching and ashing. It has several features that make it particularly suitable for use in semiconductor device fabrication. For starters, it can be used for sequential etching, which allows several etching steps to be combined in the same process with precise control over each etching layer, resulting in high-quality products. Furthermore, it also has a wide range of gas and chemical delivery capabilities, enabling the user to select appropriate gases and chemicals needed for etching or ashing. The high-precision system of TOKYO ELECTRON TE 8500 enables precise control over the etch depth, with an accuracy of +/- 0.1 microns, allowing intricate and complex etching processes. Its high-transparency quartz Chamber enables visual inspection of the wafer, and its high ion current ensures uniform etching across the surface. Moreover, it also has a fast cooldown rate that minimizes damage to the wafer, reduces defectivity and enables faster turnaround rate. Furthermore, its temperature control system is able to maintain an accurate and stable temperature, enabling more consistent etching results. Furthermore, TE 8500 is also compatible with various wafer sizes, making it a versatile tool suitable for use in a variety of process applications. In summary, TEL / TOKYO ELECTRON TE 8500 is a reliable etcher/asher that offers high precision and accuracy in etching and ashing processes, enabling intricate and uniform process results. Its high-transparency quartz Chamber, high ion current, efficient temperature control system, and fast cooldown capabilities make it an ideal choice for use in semiconductor device fabrication.
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