Used TEL / TOKYO ELECTRON TE 8500 #9394809 for sale
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ID: 9394809
Wafer Size: 8"
Vintage: 1994
Oxide etcher, 8"
Chuck type: ESC
RF Generator
ENT Shuttle
Aligner
ISO Module
Cable harness
No chillers
(2) Indexers:
881-621550-3 Control board
UDX5107 5-Phase driver
Handler arm:
BC10CA52CACDN AC Servo motor: 3000 rpm, 10 W
881-621560-2 Int conn board
893-020880-2 Control board
Prealignment:
(2) VEXTA PX244M-01A-C4 Stepping motors, 4 V, 1.2 A
808-621570-2 PA Control board
Load lock:
FGL11-X7 CKD Leak valve: 12 V, 8 W, 3.5-5 kg/cm²
Orifice: 2.2
(2) External motor driver: DBAP10CA52CS536 AC Servo driver
(2) Rotor motor driver: DBCP10CA52CDB AC Servo driver
(2) Load lock motor: BC10CA52CACDN AC Servo driver
(2) Board: 1881-022047-11 Vacuum control board
(3) C-2-FA-50-60-R3 Load lock cylinders
C-2-50-60-R Load lock cylinder
VAC Card rack:
Manostar switch: MS61L Differnetial pressure switch, 2-22 mmHg
E5AX-AH01 Temperature controller: 100-240 VAC, 15 VA, 50/60 Hz
808-62150-1 Gas I/F Board
Gas boxes:
Valve / Model / Gas / Flow rate
Pressure switch / FC-980C / - / -
MFC / FC-980C / N2 / 2 SLM
MFC / FC-980C / O2 / 100 SCCM
MFC / FC-980C / HE / 1 SLM
MFC / FC-980C / AR / 2 SLM
MFC / FC-980C / CF4 / 100 SCCM
MFC / FC-980C / CHF3 / 100 SCCM
MFC / FC-980C / HE / 20 SCCM
Regulator / SQ140-50-3P / - / -
1994 vintage.
TEL / TOKYO ELECTRON TE 8500 is an etcher (or asher) used in silicon fabrication processes to selectively remove material from a substrate. This is accomplished by exposing the substrate to reactive plasma or chemical compounds engineered to alter the material's surface properties. TEL TE 8500 is capable of performing standard etch applications using multiple etch techniques, including plasma etch, reactive-ion etch (RIE), and combinations of both. TOKYO ELECTRON TE 8500's advanced wafer alignment equipment provides excellent pattern maintenance across multiple substrates, and its process controllers enable down-stream process optimization. TE 8500 has multiple pods that are used depending on process needs. Each pod contains multiple electron cyclotron resonance (ECR) etch sources, which generate the required plasma. The chamber can be configured with different ECR sources and operating parameters, thereby providing users with a wide range of process options. TEL / TOKYO ELECTRON TE 8500 also features multiple sources for reactive-ion etching (RIE). The RIE sources enable users to tailor the etch to the exact needs of their application, resulting in improved etch selectivity and controllability, as well as excellent throughput. TEL TE 8500 has a built-in process monitoring system that helps users measure and analyze etch processing. This unit allows for real-time process optimization, wherein process variables can be quickly and precisely adjusted in order to maximize yield and throughput. TOKYO ELECTRON TE 8500 also has a digital video monitoring machine that provides an unparalleled level of precision and repeatability during the etch process. The video monitor ensures that all batches of wafers have undergone the same etching conditions, eliminating variability between batches and improving reproducibility of results. TE 8500 is an effective and accurate solution for semiconductor etching applications. With its combination of advanced automation and adaptable process parameters, TEL / TOKYO ELECTRON TE 8500 is an invaluable tool for silicon fabrication processes.
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