Used TEL / TOKYO ELECTRON TE 8500P ATC #9148203 for sale
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TEL / TOKYO ELECTRON TE 8500P ATC is an advanced processing tool for etching and ashing processes for semiconductor wafers. Its advanced technology allows for better throughput, excellent uniformity, greater precision, stringent repeatability, and minimal product contamination. The modular design of the machine allows for a wide range of configurations and applications. The process chamber of TEL TE 8500P ATC can be divided into three distinct sections: etching, ashing, and load-lock. The etching stage uses a process gas to remove either metals or dielectrics from the wafer surface. Ashing follows etching and uses an oxygen-containing process gas to remove organic residues, such as photoresist, from the wafer surface. The last section is the load-lock chamber and is used to introduce wafers into the system, as well as provide a vacuum environment for the process to take place in. The main components of TOKYO ELECTRON TE 8500P ATC include an active electrostatic chuck, source/showerhead, and gas combination unit. The electrostatic chuck holds the wafer during the processing and acts like a holder by providing thermal control in order to maintain temperature stability throughout etching and ashing. The source/showerhead is used to generate process plasmas, and is composed of an RF power distribution board, inductive ion source, and showerhead assembly. The gas combination unit mixes process gases and delivers them to the plasma chamber. It also monitors the pressure differential between the chamber and its load lock in order to maintain a desired vacuum level. TE 8500P ATC is equipped with comprehensive process control software. Its system intelligence uses autopilot mode to continually optimize the etching and ashing process. Additionally, its onboard computer can store various recipes, allowing various conditions and flows to be used with just the touch of a button. Overall, TEL / TOKYO ELECTRON TE 8500P ATC is an advanced, advanced etching and ashing workstation that brings a high-level of throughput and precision to the semiconductor industry. Thanks to its modular design and sophisticated software, it can offer excellent process uniformity and repeatability, as well as minimal contamination. Its advanced technology allows for accurate control of critical etching and ashing parameters, making it a great tool for high-end semiconductor applications.
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