Used TEL / TOKYO ELECTRON Telformula ALD High-K #9282599 for sale
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ID: 9282599
Wafer Size: 12"
Vintage: 2015
Vertical LPCVD Furnace, 12"
VCM-5D-012L Heater
Maximum operating temperature: 300°C
ART Control
N2 Load lock
Wafer type: Si SEMI STD-Notch
(50) Production wafers
Loading area light: White (LED)
RCU Duct length FNC to RCU: 20m
Chemical prefilter hydrocarb
Chemical prefilter location: FNC Top
Dry pumps missing
Wafer / Carrier handler:
Carrier type: FOUP / 25-Slots SEMI STD
ENTEGRIS A300 FOUP
Carrier stage capacity: 10
Info pad A,B: Pin
Info pad C,D: Pin
Fork material: Al2O3
Furnace facilities:
Furnace exhaust connection point: Top connection
Cooling water connection point: Bottom connection
Air intake point: Top
Gas distribution system:
IGS Type: IGS 1.5" W-Seal rail-mount
FUJIKIN IGS System
Tubing bends: <90°C
PALL IGS Final filter
IGS Regulator: CKD
HORIBA STEC IGS MFC Digital
HORIBA SEC-G111 IGS MFC For low flow N2 purge
IGS Press transducer: Nagano
HORIBA STEC LSC-F530 Liquid source vapor system
For ZAC HORIBA STEC TL-2014
Auto refill system TMA: AIR LEQUIDE / CANDI
Auto refill system ZAC: AIR LEQUIDE / CANDI
OP-500H-RE1 Ozone delivery system
Injector O-Ring material: DU353
Gas facilities:
Incoming gas connection point: Bottom connection
Gas VENT Connection point: Bottom connection
Exhaust VENT Connection point: Bottom connection
Gas unit exhaust connection point: Bottom connection
Exhaust:
Vacuum gauge pressure controller: MKS Capacitance manometer (Hot)
Vacuum gauge press monitor 133 kpa: MKS Capacitance manometer (Hot)
Vacuum gauge pump monitor: MKS Capacitance manometer (Hot)
CKD VEC-VH8-X0110 Main valve
VYX-0279-CONT Controller
EDWARDS iXH-1820T Pump
EDWARDS TPU Abatement system
Type: Burning type
Exhaust box: Wide type (1200mm)
Exhaust O-Ring material: DU353
FNC Power box: 30m
FNC RCU: 30m
Power box RCU: 30m
Power box pump unit: 30m
Power box refill system: 30m
Host communications: Comply with GJG
Equipment host I/F Connection: Power box top HSMS (10Base-T/100Base-TX)
Ingenio
OHT Capability
Load port operation: Lower and upper
PIO I/F Location: FNC Top
PIO: TEL
HOKUYO DMS-HB1-Z PIO
Carrier ID Reader writer type: RF
CIDRW Lower L/P: Read
CIDRW Upper L/P: Read
CIDRW FIMS: Read / Write
CIDRW: HOKUYO DMS-HB1-Z Series
CIDRW Tag orientation: Vertical
Customized management signals: PT / Water
Interface:
Signal tower model: LCE Series
Signal tower colors: Red / Blue / Yellow / Green
Signal tower location: Front for (10) Stockers (Left)
Front operation panel
MMI and gas flowchart: Gas box and front operation panel Installed
Indicator type: HOKUYO DMS-HB1-Z series
Operator switch: Operator access / White cover with orange light
Pressure display unit: MPa / Torr
Cabinet Exhaust pressure display: Pa
Power:
Power cable input entrance loc: Power box top
Power supply:
3 Phase connection type: Star connection
200/400 VAC, 60 Hz, 3 Phase
2015 vintage.
TEL / TOKYO ELECTRON Telformula ALD High-K is a state-of-the-art etcher / asher designed for the advanced manufacture of electronic devices. This piece of equipment is designed to provide uniform etching and ashing of ultra thin films with an accuracy of up to +/- 15A, offering superior manufacturing performance. With a reduced footprint and height of only 21cm, TEL Telformula ALD High-K has superior usability compared to other ashers, making it ideal for applications needing high precision etching. TOKYO ELECTRON Telformula ALD High-K has an advanced CIU (Chamber Interface Unit) that gives it high etch and ashing capabilities over a wide process area. By combining low pressure, high temperature and low thermal budget, this device is capable of creating intricate structures and features in both a repeatable and controllable manner, providing superior results. Additionally, Telformula ALD High-K is capable of producing more intricate patterns with injection masks and offering the ability to generate finer features utilizing line and space geometry. TEL / TOKYO ELECTRON Telformula ALD High-K has an integrated Pulsed Plasma Mode with an adjustable resonance frequency that increases the etch rate while decreasing the overall etch time. This allows for a faster turn-around time for a variety of thin films and applications. Additionally, TEL Telformula ALD High-K features fully automated robot wafer loading and quality control systems for increased process control and repeatability. TOKYO ELECTRON Telformula ALD High-K is made to be durable and reliable with periodic maintenance only being required once a year for the most demanding applications. This device is also designed to be compatible with a variety of materials such as metals, alloys, and ceramics, giving the device more versatility for manufacturers with varying process requirements. Overall, Telformula ALD High-K is a reliable and precise etcher/asher designed for a variety of modern electronic devices with superior process control capabilities. It offers a wide variety of etch and ashing modes with the ability to adjust resonance frequency, allowing for improved process control and turn-around times. TEL / TOKYO ELECTRON Telformula ALD High-K is designed to be durable and reliable and provides compatibility with a variety of materials, offering manufacturers greater versatility for production.
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