Used TEL / TOKYO ELECTRON Telformula ALD High-K #9282599 for sale

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ID: 9282599
Wafer Size: 12"
Vintage: 2015
Vertical LPCVD Furnace, 12" VCM-5D-012L Heater Maximum operating temperature: 300°C ART Control N2 Load lock Wafer type: Si SEMI STD-Notch (50) Production wafers Loading area light: White (LED) RCU Duct length FNC to RCU: 20m Chemical prefilter hydrocarb Chemical prefilter location: FNC Top Dry pumps missing Wafer / Carrier handler: Carrier type: FOUP / 25-Slots SEMI STD ENTEGRIS A300 FOUP Carrier stage capacity: 10 Info pad A,B: Pin Info pad C,D: Pin Fork material: Al2O3 Furnace facilities: Furnace exhaust connection point: Top connection Cooling water connection point: Bottom connection Air intake point: Top Gas distribution system: IGS Type: IGS 1.5" W-Seal rail-mount FUJIKIN IGS System Tubing bends: <90°C PALL IGS Final filter IGS Regulator: CKD HORIBA STEC IGS MFC Digital HORIBA SEC-G111 IGS MFC For low flow N2 purge IGS Press transducer: Nagano HORIBA STEC LSC-F530 Liquid source vapor system For ZAC HORIBA STEC TL-2014 Auto refill system TMA: AIR LEQUIDE / CANDI Auto refill system ZAC: AIR LEQUIDE / CANDI OP-500H-RE1 Ozone delivery system Injector O-Ring material: DU353 Gas facilities: Incoming gas connection point: Bottom connection Gas VENT Connection point: Bottom connection Exhaust VENT Connection point: Bottom connection Gas unit exhaust connection point: Bottom connection Exhaust: Vacuum gauge pressure controller: MKS Capacitance manometer (Hot) Vacuum gauge press monitor 133 kpa: MKS Capacitance manometer (Hot) Vacuum gauge pump monitor: MKS Capacitance manometer (Hot) CKD VEC-VH8-X0110 Main valve VYX-0279-CONT Controller EDWARDS iXH-1820T Pump EDWARDS TPU Abatement system Type: Burning type Exhaust box: Wide type (1200mm) Exhaust O-Ring material: DU353 FNC Power box: 30m FNC RCU: 30m Power box RCU: 30m Power box pump unit: 30m Power box refill system: 30m Host communications: Comply with GJG Equipment host I/F Connection: Power box top HSMS (10Base-T/100Base-TX) Ingenio OHT Capability Load port operation: Lower and upper PIO I/F Location: FNC Top PIO: TEL HOKUYO DMS-HB1-Z PIO Carrier ID Reader writer type: RF CIDRW Lower L/P: Read CIDRW Upper L/P: Read CIDRW FIMS: Read / Write CIDRW: HOKUYO DMS-HB1-Z Series CIDRW Tag orientation: Vertical Customized management signals: PT / Water Interface: Signal tower model: LCE Series Signal tower colors: Red / Blue / Yellow / Green Signal tower location: Front for (10) Stockers (Left) Front operation panel MMI and gas flowchart: Gas box and front operation panel Installed Indicator type: HOKUYO DMS-HB1-Z series Operator switch: Operator access / White cover with orange light Pressure display unit: MPa / Torr Cabinet Exhaust pressure display: Pa Power: Power cable input entrance loc: Power box top Power supply: 3 Phase connection type: Star connection 200/400 VAC, 60 Hz, 3 Phase 2015 vintage.
TEL / TOKYO ELECTRON Telformula ALD High-K is a state-of-the-art etcher / asher designed for the advanced manufacture of electronic devices. This piece of equipment is designed to provide uniform etching and ashing of ultra thin films with an accuracy of up to +/- 15A, offering superior manufacturing performance. With a reduced footprint and height of only 21cm, TEL Telformula ALD High-K has superior usability compared to other ashers, making it ideal for applications needing high precision etching. TOKYO ELECTRON Telformula ALD High-K has an advanced CIU (Chamber Interface Unit) that gives it high etch and ashing capabilities over a wide process area. By combining low pressure, high temperature and low thermal budget, this device is capable of creating intricate structures and features in both a repeatable and controllable manner, providing superior results. Additionally, Telformula ALD High-K is capable of producing more intricate patterns with injection masks and offering the ability to generate finer features utilizing line and space geometry. TEL / TOKYO ELECTRON Telformula ALD High-K has an integrated Pulsed Plasma Mode with an adjustable resonance frequency that increases the etch rate while decreasing the overall etch time. This allows for a faster turn-around time for a variety of thin films and applications. Additionally, TEL Telformula ALD High-K features fully automated robot wafer loading and quality control systems for increased process control and repeatability. TOKYO ELECTRON Telformula ALD High-K is made to be durable and reliable with periodic maintenance only being required once a year for the most demanding applications. This device is also designed to be compatible with a variety of materials such as metals, alloys, and ceramics, giving the device more versatility for manufacturers with varying process requirements. Overall, Telformula ALD High-K is a reliable and precise etcher/asher designed for a variety of modern electronic devices with superior process control capabilities. It offers a wide variety of etch and ashing modes with the ability to adjust resonance frequency, allowing for improved process control and turn-around times. TEL / TOKYO ELECTRON Telformula ALD High-K is designed to be durable and reliable and provides compatibility with a variety of materials, offering manufacturers greater versatility for production.
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