Used TEL / TOKYO ELECTRON TELFORMULA ALD High-K #9311152 for sale

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ID: 9311152
Wafer Size: 12"
Vintage: 2015
Vertical LPCVD furnace, 12" Hard Disk Drive (HDD) missing 2015 vintage.
TEL / TOKYO ELECTRON TELFORMULA ALD High-K is an etcher/asher designed for advanced packaging processes, wafer level fabrication, and lithography to achieve ultra-high resolution and superior patterning on high-aspect ratio substrates. This etcher uses a dual gun etching equipment, powered by an advanced pulsed electron beam gun which allows faster incident-beam scanning and better control of ion beam phase ratio. It has advanced vertical substrate temperature control, allowing for precise etching on a wide range of substrates. The etching process is assisted by an inert gas atmosphere, providing higher etching selectivity for higher-k materials. Moreover, the etcher has a unique electron beam focusing capability that ensures uniform coverage, for excellent patterning of through-wafer vias and contacts. It is ideal for applications that require uniform coverage over large areas. Additionally, it provides excellent edge smoothness and passivation characteristics on etch surfaces, without the need for a mask or resist. The etcher features a turbo pump system that provides fast evacuation of the etching chamber, which increases throughput and reduces downtime. The unit also has an advanced cooling machine to ensure uniform temperatures of the substrate during etching. The cooling tool also reduces the electrical power required for etching by decreasing substrate loading. The etcher is capable of processing a wide variety of materials, such as metals, oxides, nitrides, and polymers. It features an advanced data acquisition and handling asset, allowing easy communication with digital libraries and providing users with comprehensive process control for etching and annealing. The model is compatible with most major CAD packages and runs on both Windows and Linux operating systems. In summary, TEL TELFORMULA ALD High-K is an etcher/asher designed for the etching and patterning of advanced packaging processes, wafer level fabrication, and lithography to achieve ultra-high resolution on high-aspect ratio substrates. It is equipped with an advanced, dual gun etching equipment, inert gas atmosphere, cooling system, and turbo pump unit. The machine is compatible with CAD packages and runs on Windows and Linux operating systems, making it ideal for a range of applications.
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