Used TEL / TOKYO ELECTRON TELINDY Plus ALD High-K #293644138 for sale

TEL / TOKYO ELECTRON TELINDY Plus ALD High-K
ID: 293644138
Vertical diffusion furnace.
TEL / TOKYO ELECTRON TELINDY Plus ALD High-K is an etcher/asher developed by TEL, Ltd. (TOKYO ELECTRON). This advanced etching tool is used to fabricate semiconductor devices with a high degree of precision. Its advanced features make it suitable for a wide range of fabrication processes, including but not limited to: formation of high-precision devices, including trenches, grooves, and structures; plasma etching of semiconductor wafers; and atomic layer deposition (ALD) of high-k dielectric material. TEL TELINDY Plus ALD High-K is an etcher/asher that offers precise control of etching parameters and process cycle times. It utilizes a magnetron sputter-etching source to deposit a reactive ion etching (RIE) layer to the surface of the wafer. This RIE layer is then etched back with a rotatable cathode to create the desired structure. The exact depth of the etch is achievable, along with additional geometric control in the range of nanometers. In addition, the electronics of TOKYO ELECTRON TELINDY Plus ALD High-K optimizes the parameters of the sputter process itself to achieve flawless geometrical accuracy of layer fabrication. The electronics also include three independently controlled sources, allowing for an optimum and repeatable process flow. The tool can also be used for atomic layer deposition (ALD) of high-k dielectric material, due to its ability to precisely control the film deposition. The ALD process utilises gaseous precursors to create a monolayer, while the tool's AC capacitance-coupled plasma technology increases the accuracy of layer formation. The overall thicknesses of the layers formed by the ALD process can be accurately determined by the tool and can so be accurately tuned. TELINDY Plus ALD High-K offers excellent repeatability and uniformity of deposition over the entire wafer surface. As such, the tool is suitable for the fabrication and production of wafers with higher precision and efficiency relative to traditional methods. Utilizing this etcher/asher, semiconductor device manufacturers can produce products with better performance, optimum yield and high-quality, reliable results with every cycle.
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