Used TEL / TOKYO ELECTRON TELINDY Plus IRAD Oxide #293822431 for sale

TEL / TOKYO ELECTRON TELINDY Plus IRAD Oxide
ID: 293822431
Vertical furnace.
TEL / TOKYO ELECTRON TELINDY Plus IRAD Oxide is an advanced etcher/asher designed to provide high-performance plasma etching of a variety of materials. The equipment utilizes a Inductively Coupled Plasma (ICP) source to create a high-density plasma capable of processing a wide range of substrates including SiN, Polyimide, TiN, SiO2, and SiON, both at high speed and with low thermal budget. The system also features advanced computer control capabilities including a programmable End Point Detection (EPD) algorithm to ensure consistent etch process parameters across multiple substrate types. TEL TELINDY Plus IRAD Oxide features a microwave power control unit which allows direct modulation of the ICP and RF power levels for precise control of the plasma density and etch duration. This ensures precisely controlled etching with maximum throughput of up to 180 substrates per hour, making it a highly productive solution. The etch chamber incorporates a large number of turbo pumps and an integral turbopump bypass, allowing for rapid process intels cycle time. Additionally, it features an integrated wafer cooling machine to minimize thermal damage and maintain etch accuracy. TOKYO ELECTRON TELINDY Plus IRAD Oxide is capable of etching through a wide range of thicknesses and materials, including metals, nitrides, oxides, plastics, and polymers. The advanced programming/diagnostic capabilities enable remote monitoring and automatic optimization of the etch process, ensuring maximum productivity. Additionally, the tool is compatible with multiple gases, including N2, Ar, O2, and SF6, allowing for diverse etching capabilities. The etch recipes are stored for easy recall and repeatability, and can be linked with the TELINDY controller software for further customization. Overall, TELINDY Plus IRAD Oxide is a powerful etcher/asher designed to provide fast, consistent and accurate etching on a wide range of substrates. Its advanced features and automated programming capabilities ensure high-quality, repeatable etching results at an impressive rate of up to 180 wafers per hour.
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