Used TEL / TOKYO ELECTRON Telius 305 SCCM #9252316 for sale

TEL / TOKYO ELECTRON Telius 305 SCCM is a high resolution etcher that is commonly used in the semiconductor and MEMS industries. It is designed to etch or asher a wide range of substrates including silicon, metals, and polymers. It offers exceptional uniformity of etch rate and uniformity of etch depth up to 300 mm (12"). The etcher is equipped with adjustable flow control features, which allows it to adjust the rate of etch for greater material removal in a shorter period of time. It is equipped with a built in multiple electrode assemblies for etching and reactive ion etch (RIE). This etcher can handle wafers up to 8 inches (200 mm) in diameter with a depth of up to 150 microns and is rated to operate at temperatures up to 175°C. It also has adjustable gas delivery and pressure control features, allowing for a variety of ambient atmospheres including Oxygen, CF4, SF6, and air. Additionally, TEL Telius 305 SCCM is equipped with a digital control system which allows users to select one of five process parameters—etch rate, chamber pressure, target etch rate, substrate temperature and gas flow —and manually adjust each to its desired value. TOKYO ELECTRON Telius 305 SCCM also comes with an optional load lock for greater throughput and stability. This is especially useful for semiconductor and MEMS processes that require greater stability of the etch ambient. The load lock system safely protects the wafer from any sudden changes in pressure, temperature and atmospheric conditions. Moreover, Telius 305 SCCM incorporates automated process monitoring features such as a real-time process vacuum sensor, an RF plasma cleaning system, and a post-etch processing station. Overall, TEL / TOKYO ELECTRON Telius 305 SCCM is an etcher/asher designed to meet the requirements of a wide range of industries and applications. With adjustable flow control and gas delivery, real-time process monitoring, and an optional load lock, TEL Telius 305 SCCM provides users with a reliable and efficient means of etching substrates of multiple materials. Its versatility, accuracy, and user-friendly design make it a reliable choice for any etching or ashing needs.