Used TEL / TOKYO ELECTRON Telius SP 308 #293812995 for sale

TEL / TOKYO ELECTRON Telius SP 308 is a highly advanced etcher/asher tool utilized in the semiconductor industry for etching and cleaning processes in the fabrication of integrated circuits and other semiconductor devices. This tool combines cutting-edge technology with precision control to enable high-performance processing capabilities essential for achieving the stringent requirements of modern semiconductor manufacturing. At the core of TEL Telius SP 308 system is a sophisticated plasma processing chamber designed to create and sustain controlled plasma environments for etching and ashing applications. Plasma etching is a key process in semiconductor manufacturing that involves removing material from the surface of a wafer using chemically reactive plasma species. TOKYO ELECTRON Telius SP 308 offers exceptional etching uniformity and selectivity, ensuring consistent and precise material removal across the entire wafer surface. The tool features a range of plasma sources, gas delivery systems, and RF power supplies that can be tailored to meet specific process requirements. This flexibility allows users to optimize process parameters such as gas composition, pressure, temperature, and power to achieve the desired etch rates, selectivity, and profile control for different materials and device structures. Telius SP 308 is equipped with advanced process monitoring and control capabilities to maximize process stability and repeatability. Real-time endpoint detection systems ensure accurate process control by detecting subtle changes in plasma emission or other process parameters to precisely terminate the etching process at the desired endpoint. Closed-loop feedback control systems continuously adjust process parameters to maintain optimal process conditions and compensate for variations in wafer properties. In addition to etching, TEL / TOKYO ELECTRON Telius SP 308 is capable of performing ashing processes to remove organic and inorganic contaminants from wafer surfaces. Ashing is a critical step in semiconductor fabrication to ensure the cleanliness of wafer surfaces before subsequent processing steps. The tool's ashing capabilities are tailored to minimize damage to sensitive device structures while effectively removing residues and contaminants. TEL Telius SP 308 is designed for high productivity and throughput, with features such as rapid wafer loading and unloading systems, automated process sequences, and efficient gas utilization schemes. The tool's modular design allows for easy integration into existing semiconductor manufacturing lines and seamless scalability to accommodate future process requirements and production volumes. Overall, TOKYO ELECTRON Telius SP 308 represents a state-of-the-art solution for semiconductor etching and ashing applications, offering unmatched process performance, reliability, and versatility to meet the demanding requirements of advanced semiconductor manufacturing. Its precision control, advanced monitoring capabilities, and high throughput make it an indispensable tool for achieving the desired device performance, yield, and cost-effectiveness in semiconductor fabrication processes.