Used TEL / TOKYO ELECTRON Telius SP 308QS #116765 for sale
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ID: 116765
Deep trench silicon etchers
(4) Chambers (SCCM)
Load locker modules
Capacitively coupled module chambers (SCCM)
(5) Loader ports FOUP, 12"
Dual frequency source: 40 MHz and 3.2 MHz (GEW3040 and NOVA50A)
ESD Chuck
Temperature control
Aluminum alloy chamber
Material: Aluminum alloy (A6061)
Surface finishing: Hard sulfuric acid anodizing
RF Application method: Upper RF to lower electrode
Discharge method: SCCM Type
Temperature control:
Upper electrode: Temperature control by heater and cooling water
Lower electrode: Temperature control by circulating coolant
Side wall: Temperature control by heater
Shield ring
Pressure monitor
Lower electrode: Ceramics electro static chuck
Thermometer in lower electrode
Wafer holding method: Electrostatic chuck (φ300) mechanism
Focus ring: Qz
Exhaust plate: Aluminum alloy with hard sulfuric acid anodizing
Insulation ring: QUARTZ Cover / Aluminum alloy (A6061) with hard sulfuric acid anodizing
Distance between electrodes: 30~35 mm
Magnet:
Intensity:170 G (center)
Rotation: 20±1 RPM
He B.P Unit: Cooling gas for wafer back
Pressure switch: PCV (STEC)
Number of line / Control range of pressure:
(2) lines (Center / Edge): 0~7980 Pa (0~60 Torr)
Leakage monitor
Detection of valve open / Close: Valve on / Off sensor
SE2000 Endpoint detection
Window: Orifice (QUARTZ)
Deposition shield:
Material: QUARTZ
Shutter:
Plate: Aluminum alloy with hard sulfuric acid anodizing
Air cylinder drive
Final valve: Diaphragm type
APC
Manifold: Aluminum alloy with hard sulfuric acid anodizing
Chemratz O-ring for chamber
Ultimate vacuum: 0.0133 Pa (7.5 x 10-2 mTorr) / Less
Leak back: 0.133 Pa/min (1 mTorr / min) / Less
2005-2007 vintage.
TEL / TOKYO ELECTRON Telius SP 308QS is an advanced etcher/asher designed for use in Thin Film Deposition (TFD) processes. This etcher is capable of precise, repeatable etching and ashing of optical surfaces. TEL Telius SP 308QS is equipped with features that provide repeatable results with a high degree of precision over a range of material types. TOKYO ELECTRON Telius SP 308QS is equipped with a High End, High Density collimated Beam Array Results. This ensures that the energy of the beams is precisely distributed for accurate etching and ashing. The beam array results can be configured for specific material types, thus increasing the etch repeatability and ashing stability. Telius SP 308QS also features temporal beam control systems. This allows the user to control the rate of etching and ashing, allowing them to customize their process to achieve the desired result. TEL / TOKYO ELECTRON Telius SP 308QS has a programmable temperature control feature which allows the user to select a desired temperature profile for the etching and ashing processes. The temperature control can then be fine-tuned to achieve the best possible results. TEL Telius SP 308QS also features an advanced communications system which allows it to be easily integrated with existing production processes. This allows the user to link the etcher/asher to their production line and monitor the progress of their process. TOKYO ELECTRON Telius SP 308QS also has a versatile production control system. This allows the user to set a variety of parameters to ensure the accuracy of their process. This includes the ability to set etching and ashing parameters for different types of materials, choose between constant temperature or pulsed heating, activate cleaning cycles, automatic shut-off, and more. Telius SP 308QS is a powerful, advanced etcher/asher designed to address a wide range of TDD processes. It's reliable, precise, and controllable for high-accuracy results. The user-friendly interface allows the user to easily configure and monitor the etching and ashing process, ensuring consistent and repeatable results.
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