Used TEL / TOKYO ELECTRON Telius SP #293657406 for sale
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TEL / TOKYO ELECTRON Telius SP is a state-of-the-art etching and ashing machine used in the production of advanced semiconductor devices. It provides reliable and high-throughput etching of advanced process features with unequalled precision and control. The machine is capable of producing consistent results at various temperatures and throughput levels. TEL Telius SP features an advanced gaseous etch source that ensures uniformity in etching at various temperatures. This advanced etch source is temperature controlled and incorporates pressure, flow, and reactants control for improved process control and improved etching performance. In addition, the etch source can be adjusted to provide fast and accurate etching on a variety of both unpolished and polished wafers. TOKYO ELECTRON Telius SP's advanced gas source is configured with a built-in quartz etch chamber, pulsed-DC etch power unit, and digital readout meter for precise etching. Digital computer-controlled pulse and DC etching ensures optimal uniformity and accuracy in process results. Telius SP also features a flat panel display (FPD) that provides users with direct process feedback signals. The advanced wet-etching capabilities of TEL / TOKYO ELECTRON Telius SP provide a wide range of reactive wet etching profiles. Start-to-finish profiling and source parameter optimization ensure improved etching and removal performance, resulting in superior process yield and increased throughput. An automatic wet etch switch allows users to conveniently switch between wet etch and dry etch profiles. TEL Telius SP also features a precise dry etch equipment with automated pressure, temperature controls, and process monitoring for increased etching optimization. Dry etch capability is also available for backside or double-sided process flows. The on-board built-in etch chamber is capable of holding large wafers with a uniform etch distribution throughout. TOKYO ELECTRON Telius SP offers a variety of additional features and accessories to increase its functionality. Its automatic weight control system (AWCS) and wafer handling robot (WHR) are designed to provide improved process accuracy and reliability. A cooled chuck is available for wafer or substrate cooling. An additional etch tool, such as a reactive ion etch (RIE) unit, can be added to enable the machine to perform reactive RIE etching. Telius SP is the perfect solution for the etching of advanced process features, as well as achieving reliable, uniform processes with superior throughput when compared to other etch systems. Its flexibility, advanced source technology, and process optimization capabilities make it the ideal etching machine for high-end semiconductor production.
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