Used TEL / TOKYO ELECTRON Telius SP #9197560 for sale

TEL / TOKYO ELECTRON Telius SP is a fully automated etching / ashing equipment designed for etching and ashing materials used in semiconductor and flat panel display fabrication. The system is capable of performing full lithography etching and ashing of wafers in a single process. This saves time and cost and helps to achieve better yields. The unit is typically equipped with an ultra-thin film deposition chamber, an etch chamber, and an ashing chamber. The ultra-thin film deposition chamber is designed to deposit ultra-thin layers of materials necessary for the fabrication of semiconductors. The etch chamber is used to perform precision etching of layers, while the ashing chamber is used to perform chemical ashing tp remove the unwanted film layers. The machine incorporates an automated load lock mechanism and a cassette-to-chamber transfer tool. The automated load lock mechanism facilitates the loading and unloading of substrates while the cassette-to-chamber transfer asset is used to transport substrates from the cassette to the individual processing chambers. TEL Telius SP is capable of producing high-density dielectric patterns with sub-micron vertical and lateral resolutions. It offers high-uniformity as well as repeatability, which makes it suitable for applications requiring precision processing. The model also offers superior process control, which helps to ensure repeatability of process results and high quality fabrication. In addition, TOKYO ELECTRON Telius SP includes an integrated recipe and data handling equipment, which allows the user to safely store and retrieve process recipes and results. This helps improve process consistency and overall efficiency. Overall, Telius SP is a reliable and efficient system that delivers high-precision etching and ashing results for a wide range of device fabrication applications. Its automated safety functions, advanced recipe and data handling unit, and user-friendly operation make it ideal for achieving precise and cost-effective device fabrication processes.