Used TEL / TOKYO ELECTRON Telius SP #9197577 for sale

TEL / TOKYO ELECTRON Telius SP
ID: 9197577
Wafer Size: 8"
Vintage: 2004
Oxide etcher, 8" (3) Telius SP vesta chambers 2004 vintage.
TEL / TOKYO ELECTRON Telius SP is an etcher / asher used in the semiconductor fabrication industry. It is a full-size asher designed to handle high-density wafers and provide superior performance for critical semiconductor requirements. TEL Telius SP is a full-size tool made up of a 5-axis linear drive loading equipment with a multiple wafer transfer cart. It features a 19-inch display console and keyboard with multiple language choices. The layout allows easy leaded/unleaded device switching and features an automatic wafer handling system with integrated liquid filter. The unit is constructed with high-grade stainless steel for better corrosion resistance, and is pre-wired with an ESD safe cable. TOKYO ELECTRON Telius SP has multiple process chambers with a 4-axis spinner, giving users excellent control over the etching and ashing processes. The spinner is capable of Fast-spinning and High-resolution spinning, as well as a variable speed range from 10k rpm to 25k rpm. It also features an improved differential pressure control machine, optimized vacuum technology, and uniform power supply. The cleaning process is also improved, featuring a hydrogen bromide process to effectively clean wafers and replenishment of cleaning chemicals automatically. Telius SP also has a Generative Cooling Chamber, which enhances the removal of reaction products and decreases mask damage. In addition to its high-precision etching and ashing capabilities, TEL / TOKYO ELECTRON Telius SP offers advanced safety features, such as automatic user access control, shock detector, and fire protection tool. It also comes with a variety of process management tools and integration for different TEL software. TEL Telius SP is a perfect tool for high-volume production and high-precision quality control in a semiconductor fabrication facility. It is designed to handle different wafer sizes and thicknesses with fast cycle times and a high precision process. It achieves better process results due to its temperature, time and current tracking capabilities, and is equipped with a wide range of process control options.
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