Used TEL / TOKYO ELECTRON Telius SP #9197580 for sale

TEL / TOKYO ELECTRON Telius SP is an advanced etching equipment designed for mass production in the semiconductor device fabrication industry. It is a three-axis etcher combining motion stages, high-powered etching process chambers, and vacuum deposition systems. The system is capable of providing extremely precise control of the etching process parameters for a wide range of substrates including wafers, films and waveguides. Its advanced technology results in a high repeatability rate, low defect rate, and fast processing times. TEL Telius SP offers both vertical and horizontal etching capabilities, with both processes being independently controlled for maximum flexibility. The vertical etching process uses a plasma-free etching process chamber for etching by a physical ablation method such as sputter etching or thermal oxide etching. This process is designed to provide precise control and uniformity of the etch depth and that of the side walls. Its horizontal etching process utilizes a separately controlled plasma etching chamber, allowing reliable and sharp profile control with excellent feature definition. The high-tech etching process chamber in the unit features an advanced machine of gas flow channels and pumps that are precisely controlled, allowing adjustment of the gas pressure and gas flow rates to attain the desired etch rate. The integrated vacuum deposition tool allows rapid deposition of silicon nitride, silicon oxide, and poly-silicon over various substrate materials. This can be helpful for etching applications requiring superior protection from environmental contamination. Furthermore, TOKYO ELECTRON Telius SP offers a wide range of additional features to improve process convenience and output. These include a highly sensitive load port cleaning station to continuously clean the process chamber, real-time monitoring of etch rates, specialized programmable center monitoring, automated alignment of substrates, and several recipe management systems to allow for a rapid changeover between different etch processes. In conclusion, Telius SP is a highly advanced three-axis etching asset that offers superior results compared to traditional etching processes. Its combination of motion stages, etching processes, and vacuum deposition systems allows for an unprecedented level of control over the etching process parameters, resulting in repeatable and reliable etching results for wide range of substrates. Additionally, its load port cleaning station, real-time monitoring, automated substrate alignment, and recipe management systems further provide invaluable features that enable maximum control and ensures a high throughput and output quality.