Used TEL / TOKYO ELECTRON Telius SP #9197605 for sale
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ID: 9197605
Wafer Size: 8"
Vintage: 2003
Oxide etcher, 8"
(2) Telius SP vesta chambers
2003 vintage.
TEL / TOKYO ELECTRON Telius SP is an advanced etcher/asher used for processing silicon wafers. It is specifically designed for semiconductor device fabrication, making it ideal for etching and ashing applications like MEMS, MOEMS, and micro-scale feature patterning. The equipment consists of components such as a multi-chamber HDX unit, a load lock port, waffle pods, a major mainframe controller unit, and multiple peripheral units. The HDX unit is capable of etching and ashing on one wafer at a time. The load lock port can store up to 16 wafers and features a 150mm transfer robot arm that helps transfer wafers from the port to the pods. The waffle pods can store up to 60 wafers each and help provide precise, controlled etching/ashing operations. The mainframe controller unit is responsible for managing the system's operation, including parameters for processing recipes, process equipment control, and data management. This unit also communicates with peripheral units including the LCD display, the touch panel operators unit, and the gas-supply control unit. TEL Telius SP is equipped with advanced functions such as batch wafer processing, RFID data tracking, and automated shuttles. It can also be operated remotely via an Ethernet connection. Additionally, its low environmental impact is attractive to customers looking to reduce their footprint. In terms of operations, the unit provides precise and repeatable results with a production cycle time of 15.4 minutes. Vacuum-assisted AGC plasma source technology enables high-quality, optimized etching/ashing results. The use of electrode force Tuning-TEC also helps to reduce within-batch particle generation, ensuring yield improvements. Overall, TOKYO ELECTRON Telius SP is an effective machine with advanced capabilities that enable high-quality etching/ashing applications. Its precise and repeatable results as well as its low environmental impact make it an ideal solution for semiconductor device fabrication.
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