Used TEL / TOKYO ELECTRON TELIUS TSP-30444VVV #9219374 for sale

TEL / TOKYO ELECTRON TELIUS TSP-30444VVV etcher/asher is an advanced, high-performance wafer-processing tool used in the semiconductor industry. It is primarily used for etching, ashing, or thinning processes. This etcher is well-suited for applications that require accurately controlled etching and ashing with high throughput. The TSP-30444VVV is a fast, precise, and cost-effective etcher and asher that can handle a wide range of wafer sizes (up to 150mm). The etcher features a powerful pulse DC etching and ECR plasma ashing technologies that provide smooth etching and high uniformity. The tool also comes with encoder-controlled scanning, which ensures precise and repeatable results. The TSP-30444VVV includes a powerful gas feed control equipment, which enables accurate endpoint detection even in the presence of process gases with large differences in reactivity. This system also provides the ability to fine-tune the etching or ashing process more accurately and to produce uniform results on wafers of varying sizes and materials. The unit also features an integrated vacuum machine that ensures that particles don't adhere to the wafers during the etching or ashing process. This tool also helps to reduce the risk of process contamination and to maintain the high quality of the wafer surfaces. The etcher includes an automated wafer-loading asset that can accommodate up to 8 individual wafers in a single batch, thus increasing throughput and enabling multiple processes to be executed in a short period of time. The etcher also features a programmable recipe storage model which allows for easy programming of one or more customized process recipes. The advanced TSP-30444VVV is designed to provide reliable, repeatable results with a wide range of etching and ashing processes. Its sophisticated gas feed control equipment and efficient wafer loading capabilities help to make it a highly efficient tool for semiconductor manufacturers.