Used TEL / TOKYO ELECTRON Telius TSP-30555SSS #9231837 for sale
URL successfully copied!
Tap to zoom
ID: 9231837
Wafer Size: 12"
Vintage: 2004
Dry etchers, 12"
Process: SHIN
Processing type: Vacuum
Wafer type: Notch
VAT 65051-JH52-AUD1 APC, 14"
Process gases:
Gas 1: CO (100 SCCM)
Gas 2: COS (15 SCCM)
Gas 3: C4F6 (30 SCCM)
Gas 4: C4F8 (30 SCCM)
Gas 5: CH2F2 (30 SCCM)
Gas 6: N2 (150 SCCM)
Gas 7: CO (150 SCCM)
Gas 8: AR (2000 SCCM)
Gas 9: CHF3 (60 SCCM)
Gas 10: CF4 (30 SCCM)
Gas 11: O2 (30 SCCM)
Gas 12: O2 (2000 SCCM)
Gas 13: CO (150 SCCM)
Gas 14: CO (150 SCCM)
Gas 16: O2 (10 SCCM)
Gauge:
Unit / Make / Model / Range
Baratron (CM 1) / MKS / 627BRETDD2P / 33.33 PA
Baratron (CM 2) / MKS / 627B11TDC2P / 1.333 PA
Baratron (CM 2) / MKS / 626A01TDE / 133.32 PA
Baratron (CM 2) / MKS / 51A11TGA2BA003 / 1.333 PA
BA Gauge / INFICON / BPG400 / -
SHIMADZU EI-4203 LMC-T1 Turbo Molecular Pump (TMP)
SHIMADZU EI-4203MZ Turbo Molecular Pump (TMP) Controller
SCINCO SELME12ZS-BP3 Robot
HV Controller
DAINEN AGA-50B2 Generator
WGA-50E Generator
HPK10Z1-TE2 DC HV Generator
DAINEN AMN-50E3 Matcher
DAINEN WMN-50C4 Matcher
Sub module:
AC Rack
DC Rack
Carrier stage: (4) Load ports
Process module: (4) Power supplies
Gas box: (3) Power supplies
Data back up: FD
Gas line injection: 16 Line
Gate: V-TAC
Missing parts:
End point detection
Chamber PC and bottom and gas and electronic B/D
SE2000 EPD Sensor
AC Rack main
Chamber 15 gas lines MFC
2004 vintage.
TEL / TOKYO ELECTRON Telius TSP-30555SSS etcher/asher is a high-precision thin-film deposition and removal equipment designed for advanced research and production. This etcher/asher utilizes an integrated vertical vacuum technology coupled with advanced control software to provide both depositing and removing abilities with high accuracy and throughput. The TSP-30555SSS features an intuitive touchscreen controller and color monitor to provide an easy to use interface which makes operation and maintenance convenient. The system has a single-wafer process capability and comes with two adjustable probes for precise manipulation of wafers. This etcher/asher can accommodate sample sizes ranging from 2" up to 8" with automatically adjustable positioning. It offers a wide variety of deposition and etch gases, including oxygen, nitrogen and carbon tetrafluoride. At the heart of this unit is a robust DC magnetron sputtering powered by a high-frequency RF source for high productivity. This etcher/asher also features full PID temperature control of the wafers. The temperature range achievable is from 80° Celsius to 450° Celsius. In addition, the TSP-30555SSS has the ability to process both semiconductor and metal films. The machine is equipped with a wide variety of pellets and mesh materials for use in such applications. It also has simultaneous metal ion etching and seeding capabilities. The TSP-30555SSS is a user-friendly, reliable, and cost-effective etcher/asher. Its high precision, superior process control, and wide range of available materials make it an excellent choice for advanced research and production.
There are no reviews yet