Used TEL / TOKYO ELECTRON Trias TI/TIN #293644140 for sale

TEL Trias TI/TIN is an etching equipment (also called an asher) used to fabricate integrated circuit (IC) substrates. It uses an electrically powered metal source to create metal-based patterns on a substrate. The asher is composed of various functional components, including a substrate, a Reaction Chamber, a Temperature Control Unit, an Etch Electrode, and an Etch Gas. The substrate of TOKYO ELECTRON Trias TI/TIN is a metal, semiconductor, or insulator material that provides the support for the metal etch electrodeposition. It is placed in the reaction chamber of the system, where it is exposed to the etching gas. The reaction chamber of TEL / TOKYO ELECTRON Trias TI/TIN is a sealed chamber that allows for the etch gas to come in contact with the substrate. It also houses the temperature control unit which monitors the temperature of the etch gas. The etch electrode is the metal source of the asher. It contains a source of a metal source, such as TiN or W, and is housed in a separate chamber from the reaction chamber. The metal source is heated and the ions are brought in contact with the substrate. The etch gas is used to enable the metal etching process. It typically consists of a combination of a fluorine based gas, such as chlorine and a reactant gas, such as hydrogen. The etch gas helps to etch the metal source onto the substrate while also preventing damage to other components of the unit. Finally, the temperature control unit of the machine is used to regulate the temperature of the reaction chamber. This ensures that the temperature is maintained at an acceptable level to optimize the etching process. Overall, TEL Trias TI/TIN etching tool is highly efficient and versatile. It is designed for use in the fabrication of a wide range of IC substrates. It is low maintenance and can handle a large amount of substrate materials at once. Furthermore, the asset is well-suited for both manual and automatic operations, making it an ideal solution for creating complex IC patterns and features.