Used TEL / TOKYO ELECTRON Trias TI/TIN #9294214 for sale

TEL / TOKYO ELECTRON Trias TI/TIN
ID: 9294214
Wafer Size: 12"
Metal CVD system, 12".
TEL Trias TI/TIN is an etcher/asher specifically designed for semiconductor processing needs in the electronics industry. It is capable of multi-step and multi-product processing, enabling the production of high-quality wafers while utilizing a cost-effective production equipment. Its intended use is to accurately deposit patterns and materials on specific areas of a semiconductor wafer in order to produce a device or semiconductor product. The system makes use of reactive ion etching (RIE) technology in order to achieve precision pattern and material deposition. TOKYO ELECTRON Trias TI/TIN is equipped with state-of-the-art features, including the following: a simplified user interface with intuitive menus, an automated wafer loader, and components designed to reduce vibration. The wafer is held in place by an electrostatic clamp inside the process chamber to ensure accurate and consistent patterning. The Trias TI/TIN also offers a variety of coaxial and parallel multi-gas lines and a scanning laser unit to monitor the thickness of the materials being deposited. Additionally, the machine offers enhanced safety, including personnel safety interlocks, a built-in exhaust tool, and a ground fault interrupter (GFI). TEL / TOKYO ELECTRON Trias TI/TIN offers a wide range of etching capabilities, making it ideal for manufacturing solutions in the semiconductor field. It offers advanced aluminum etch capabilities, allowing for high-speed etching and ramping capability for critical aspect ratio applications. It also offers industry-leading via etch and via hole etch capabilities, providing increased depth and reproducibility for precision applications such as damascene trenching. Additionally, the asset offers advanced etch features such as optical through-etching and sidewall etching for controlled edge profiles. In short, TEL Trias TI/TIN is an etcher/asher that offers advanced features and capabilities to meet changing demands in the semiconductor industry. It utilizes its precision patterning and reactive ion etching technology to ensure accuracy and cost effectiveness in the production of high-quality wafers. Additionally, its variety of coaxial and parallel multi-gas lines, scanning laser model, and enhanced safety features ensure reliability and protection during the manufacturing process.
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