Used TEL / TOKYO ELECTRON Trias #9049825 for sale
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ID: 9049825
Wafer Size: 12"
Vintage: 2009
CVD System, 12"
(2) Chambers: CVD & ALD
Process: NiOx, HfOx
Trias cluster: (2) Loadports
EX Module, PM2
LM: Front end / UPS
Main power distribution (MPD)
Transfer module, TM
High-k CVD reactor (PM4):
Thermal based deposition
Plasma capability: No
Includes: Spares
High-k CVD reactor, PM2:
Retrofitted for thermal ASFD (ALD) based deposition
Plasma capability: No
Includes:
Ozone capability
LDS Systems:
(3) Schumacher chemguard LDS (Air products)
Multi candi LDS (Air liquid)
PM2:
Hafnium
Nickel
Titaan
Vanadium
PM4:
Hafnium
Nickel
Titaan
Ruthenium
Strontium
PM4 Transformer box (Hi-K) option elec box:
(2) Touch screens ozonizer, PM2
(3) H2O Boxes: Air products schumacher CGII500 LDS
Process used: NiOx
Complete platform + (2) chambers CVD & ALD
Trias cluster
(2) Loadports
Manuals included
2009 vintage.
TEL / TOKYO ELECTRON Trias is a multi-functional etcher/asher equipment designed for advanced semiconductor device fabrication. It features an advanced alkaline ashing process that employs inductively coupled plasma (ICP) sources for high-speed, high-density dry cleaning of samples. The system also offers an advanced dry-etching platform for ultra-high-density devices and offers a suite of processes for etching III-V devices and nanowire structures. TEL Trias unit features a fully adjustable chamber and gas delivery machine that allows for precise control and optimization of chamber conditions and etching parameters such as gas flow, etch rate, temperature, and pressure. This ensures excellent repeatability and uniformity of etch results. The tool also has an integrated robotic mechanism for efficient automation of sample loading and unloading, eliminating the need for manual loading and unloading of samples. Additionally, TOKYO ELECTRON Trias asset offers integrated process diagnostic and monitoring tools and real-time optimization capabilities, allowing for more accurate process control and improved yields. Trias model supports a wide range of etching gases, including chlorine, fluorine, chlorine trifluoride, and nitrogen tetrafluoride. It also has an in-situ gas delivery equipment for consistent process performance and excellent repeatability. The etching process can be easily tuned to meet specific device requirements. The system also features a multi-wavelength, spectral monitoring unit that allows for optimization of etching results for specific device requirements. This machine is capable of measuring the etching process in real time using optical emission spectroscopy and includes a data analysis package for optimizing the etch process. TEL / TOKYO ELECTRON Trias tool utilizes advanced safety and environmental control technology to ensure clean, dry, and safe operation for etching processes. It has also been designed for a compact footprint and can easily fit within a standard research lab, making it an ideal, cost-effective choice for today's research and device fabrication needs.
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