Used TEL / TOKYO ELECTRON Trias #9357277 for sale
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ID: 9357277
Wafer Size: 12"
Vintage: 2006
CVD System, 12"
Process: BL GL TiN Dep
BROOKS AUTOMATİON TLG-LON Load port, (3) FOUPs
SHINKO SELOP12F25-30A-13
SHINKO SBX92101286-3 FI Robot
FUJI M-UPS050J22L-UL UPS
SANEI GIKEN TL7KCPVB-2P Chiller
MPD
Transformer box
Mainframe:
YASKAWA XU-RVM4100 Buffer robot
V TEX I-I-98009-2-1 LLM1.2 Gate valve
KITZ DOUBLE ACTION Chamber gate valve
Process chambers: PM1, PM2, PM3, PM4
Single wafer chamber
With stage heater
RKC INSTRUMENT INC Module heater controller
TEL TMC2001 Module heater controller
Cubic trap
VERIFLO SQ-MICRO-602PUPGPA Regulator
LEYBOLD TSR211S Pirani sensor
INFICON VSA100A Pressure Sensor
MKS 626A01TDE Capacitance manometer
LEYBOLD CDG160A-S 1330PA Capacitance manometer (1333Pa)
LEYBOLD CDG160A-S 133PA Capacitance manometer (133KPa)
STEC VC131004ST20 Vaporizer (TiCL4)
Gases:
Gas / Make / Model / Valve
MFC2 / ClF3 / SAM / SFC1470FA / 500 SCCM
MFC3 / N2 / SAM / SFC1480FAPD / 0.6/2 SLM
MFC5 / NH3 / SAM / SFC1481FA / 5 SLM
MFC6 / NH3 / SAM / SFC1480FAPD / 300 SCCM
MFC7 / N2 / SAM / SFC1480FAPD / 0.6/2 SLM
MFC8 / NH3 / SAM / SFC1480A / 1 SLM
MFM / TiCl4 / STEC / SEF-8240 / 100 SCCM
2006 vintage.
TEL / TOKYO ELECTRON Trias is an etching / asher equipment designed for complex and advanced microfabrication applications. It is capable of cost-efficient production with high throughput and with superior process control. The system incorporates features such as a three-axis stage for accurate wafer alignment, and an auto mapping unit to ensure uniform etching. The machine is capable of handling wafer sizes from 6" to 12". It can also estimate the etching time for each application, so users can maximize production throughput. It uses an inductively-coupled plasma source to provide uniform etching over the whole wafer area. TEL Trias tool features an advanced chamber design to reduce contamination. It includes a high-performance cylindrical pump and a large-volume storage box to reduce exhaust time. The box also contains a dynamic purification asset to ensure reliable etching conditions. The model is process-automated to ensure productivity and quality. Auto-focus systems and auto-mapping are provided to speed up process setup and completion times. The integrated etching chamber is designed for uniformity and repeatability throughout the process. A full suite of process monitoring features are also incorporated into the equipment. This includes multi-channel real-time monitoring of process parameters, leak detection, pressure balance monitoring, wafer alignments, and other process parameters. All parameters are adjustable for each application. The system also features an online help feature with a comprehensive database of information regarding setup, operation, and troubleshooting. Error reports and alarms are provided to help users quickly identify and address process-related issues. Finally, the unit has several safety features designed to ensure operator safety and reliability during the etching process. These include a positive pressure isolation machine, an RF leakage detector, an exhaust control tool, and other safety features.
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