Used TEL / TOKYO ELECTRON TSP-30555SSS #293809043 for sale

TEL / TOKYO ELECTRON TSP-30555SSS is an etcher / asher with advanced features that is used for creating high quality images and patterns on a variety of substrates. It uses a combination of dry etching and wet processing to make complex etches on various materials such as silicon, quartz, and metals. The equipment has five tool chambers with distinct characteristics and uses an RIE (Reactive-Ion Etching) process, where plasma ions react chemically with the material surfaces to remove a predetermined layer. TEL TSP-30555SSS has a highly uniform etch profile because of its RIE process configuration. The gas distribution can be easily modified in order to produce a range of etch profiles, such as isotropic, anisotropic, deep penetration, and shallow etch. The gas flow control system is composed of a flow valve, mass flow controllers, an automated valve actuator, and an electro-thermal voltage regulator. The unit allows for precise control of both pressure and gas flow, in order to achieve the desired etch profiles. This machine is capable of etching depths ranging from 0.2 to 22.1μm. In addition, TOKYO ELECTRON TSP-30555SSS can also be used for wet processing. It has an in-situ, high-pressure wet cleaning tool that is able to make very precise and high-quality images. The asset has pressure, temperature, time, and solvent control to optimize the cleaning process. This allows for etching profiles to be optimally tuned depending on the application. TSP-30555SSS also has improved safety features. It is equipped with an automated safety model that stops the equipment if an anomaly in the etching or wet processing is detected. It also features an integrated water-flow rate sensor that ensures the cleaning process is running smoothly and within safety guidelines. The system also has an advanced venting unit to reduce harmful fumes and particles released during etching and wet processing. Overall, TEL / TOKYO ELECTRON TSP-30555SSS is an advanced etcher/asher designed to achieve a high level of precision with a variety of material substrates. It has the capability to produce high-quality patterns and images with its RIE process and precise wet processing. The machine also has improved safety features to ensure a secure etching environment.