Used TEL / TOKYO ELECTRON UNITY 2E 85 SCCM #9293825 for sale

TEL / TOKYO ELECTRON UNITY 2E 85 SCCM
ID: 9293825
ICP Etcher Type: RIE.
TEL / TOKYO ELECTRON UNITY 2E 85 SCCM is an etcher or asher that uses selective chemical vapor deposition (SCVD) and is capable of etching high aspect ratio structures on silicon-containing wafers. This etcher/asher utilizes plasma in order to etch the wafers and can etch features with aspect ratios as high as 5:1. The etcher is capable of etching through a wide range of wafer substrates, including silicon, poly silicon, silicon dioxide, silicon nitride, copper, and more. In addition to SCVD etching, TEL UNITY 2E 85 SCCM also has additional etch processes, including reactive ion etching (RIE) and ion etching. This etcher utilizes high aspect ratio ion implanters in order to etch high aspect ratio structures within semiconductor layers. In addition to these etch processes, the etcher can also be used for wafer surface cleaning. TOKYO ELECTRON UNITY 2E 85 SCCM also has a two-dimensional process controller for optimizing etching processes as well as a digital data logging system that helps to monitor and analyze etching results. The etcher's intuitive user interface makes it easy to set up, operate, and maintain. Additionally, the etcher is compliant with all ISO standards, making it ideal for use in a manufacturing environment. The etcher also features a toggle mass flow controller for precise control of etch reactors, as well as advancedpressure controller that helps to achieve uniformity in etching. Furthermore, the powerful electric components within UNITY 2E 85 SCCM provide precise control of the etching process, while the advanced heat transfer system helps to keep the etch chamber and the wafer substrate at a consistent temperature. Overall, TEL / TOKYO ELECTRON UNITY 2E 85 SCCM is an advanced etcher/asher that is capable of etching high aspect ratio structures on a wide range of substrates while meeting the highest standards in the semiconductor industry. Its advanced etch processes, digital data logging system, precision control components, and intuitive user interface make it an ideal tool for etching semiconductor wafers in a manufacturing environment.
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