Used TEL / TOKYO ELECTRON UNITY 2E 855 DD #9290492 for sale

TEL / TOKYO ELECTRON UNITY 2E 855 DD etcher/asher is an advanced chemical processing tool designed for semiconductor packaging and other advanced applications. The product is based off TEL Vacuum Corrosion Remediation (VCR) technology. The etcher/asher is a single-chamber system that offers a dedicated vacuum source, allowing for both etching and ashing processes to take place in the same chamber. This allows for superior process control and low contamination in a compact form-factor compared to traditional multiple-chamber systems. The etcher/asher features a high-energy, microwave-powered ion source that allows for efficient ion bombardment, resulting in superior process control and precise etching of multiple materials. It can also serve as an asher through its integrated oxygen-injection system, providing superior cleaning of parts with its technical advantage of low-concentration Oxygen Control Protocol (OCP). The etcher/asher has additional features to further improve etching and ashing accuracy and flexibility. These include a variable frequency power source, an advanced nozzle design for improved process control, a patented DCMC (diffusion cooling and microwave connection) technology for improved process control, a multi-zone gas flow regulation system, and a range of nozzle tips for process control. The etching/ashers's compact design also adds reliability and flexibility to the device, allowing for the usage of a variety of different formats such as panels, substrates, and wafers. This feature also provides factory automation due to its compatibility with standard automation platforms, and improved safety due to its user-friendly features and automation features. TEL UNITY 2E 855DD etcher/asher is an advanced etching/ashers solution, offering superior flexibility, process control, and reliability over traditional multiple-chamber systems. Its microwave-powered ion source, variable frequency power source, and advanced nozzle design make it an ideal choice for any semiconductor packaging and etching/ashers applications. It is also an attractive option for users due to its small footprint, improved safety features, and factory automation compatibility.