Used TEL / TOKYO ELECTRON Unity 2E 855 DI #9285005 for sale
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TEL / TOKYO ELECTRON Unity 2E 855 DI is a high-performance etching equipment used in the semiconductor industry. The system is ideal for etching high-precision structures on a variety of materials including silicon, silicon oxide, silicon nitride, and metals. The unit is capable of producing feature sizes between 10 to 1000nm, and can be used for both dry and wet etching. The machine consists of two main components; the etch chamber and the power source. The etch chamber provides a high-vacuum environment for etching and a protective atmosphere for the etched material. The power source consists of a high frequency generator and a power controller that produce an alternating electrical field to activate the etch process. The electrical energy is reflected back to the etch chamber, which is used to drive the reactive species towards the workpiece. The tool has a process gas inlet and is able to handle a variety of gases, including CF4, CHF3, and ArCl. These gases are used to form various chemical species in the etch chamber. The chamber is equipped with an agitation asset that circulates the process gas and energetic ions within the chamber, in order to ensure uniform etch distributions across the workpiece. Most importantly, TEL Unity 2E 855 DI is highly precise and precisely controllable. The numerical control model is capable of varying the electrical parameters such as the frequency and current levels, and of regulating and maintaining the etch rate. Furthermore, it is capable of accurately controlling the etch process parameters such as pressure, temperature, and gas flow. In summary, TOKYO ELECTRON Unity 2E 855 DI is an advanced high-performance etcher/asher used for precision microstructures within the microelectronics industry. The equipment is capable of exact control of the parameters, for uniform etch distributions and uniform etchant composition across the workpiece. The alternating electrical field produced activates the etch process, with the etch rate accurately controlled, enabling high precision microstructures.
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