Used TEL / TOKYO ELECTRON Unity 85DD #293827845 for sale

TEL / TOKYO ELECTRON Unity 85DD is an automated and programmable etcher/asher that is used in the fabrication and production of semiconductor wafers. This machine consists of four fundamental components: the loadlock chamber, the electrostatic chuck, the reactive ion etching (RIE) process, and the physical vapor deposition (PVD) system. The loadlock chamber is an enclosed environment with ultra high vacuum conditions that allows for the loading and unloading of the substrates. The internal temperature is variable so different applications may be performed and the one-follows approach allows loading and unloading of the etching gas. The electrostatic chuck allows for the wafer to be held in place during the etching/ ashing process. The RIE process is used for the etching and physical vapor deposition (PVD) is used for the ashing process. The RIE process involves applying a voltage between the substrate and the chuck which creates an electrical field. This electrical field allows for the creation of a plasma discharge which displaces the deposition material that is surrounding the substrate. The PVD process involves the creation of a layer of material through the bombardment of gas molecules with a high energy source. This energy source can be high frequency power or ion beam energy, such as argon ions in the case of TEL Unity 85DD asher/etcher. Due to the unique capabilities of TOKYO ELECTRON UNITY 85 DD, the process time can be optimized with the automated hardware and advanced software. The interface of the device includes a capacitive touch panel and a sensor to monitor the various stages of the application process. Depending on the specific application, this device can handle wafer sizes up to 8" and has features that optimize etching uniformity, etching rate, process time, and particle control for higher yields. Overall, TEL UNITY 85 DD is an advanced etcher/asher designed for the fabrication and production of semiconductor wafers. The device has an intuitive user interface, automated hardware, and integrated software which allows the process time to be optimized. It can handle substrates sizes up to 8", and features such as etching uniformity, etching rate, process time, and particle control for higher yields for specific applications.