Used TEL / TOKYO ELECTRON Unity II #184470 for sale
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ID: 184470
SSCM chamber, 8"
Configuration with Yttrium Process Kit
Unity M Platform
Turbo Pump Seiko Seiki Stp A2203 Wi-U For The Sccm Chamber
Software Rev.3.60
End point detector box
12 Gas Configuration:
GAS PM1
C4F8 30
C5F8 20
CO 500
AR 1000
O2 30
CH3F 50
C4F6 30
N2 500
CF4 100
CHF3 100
O2 1000
H2 500
Accessories:
(1) Alcatel Dry Pump Adp122 P For Process Chamber
(1) Chiller Smc Tcu Dual Channel, Pm1
(1) Generator Rack For Pm1 60mhz And 2 Mhz
Chamber currently installed in system
2000 vintage.
TEL / TOKYO ELECTRON Unity II is an etcher / asher equipment used for fabricating advanced semiconductor device structures. It is a fully-automated system that uses a gas-phase reaction chamber to achieve substrate etching and ashing, resulting in atomic level precision film thickness control and high uniformity across the wafer. The machine is capable of supporting multiple processes and is equipped with advanced processes such as HF (etching), ICP (etching), CVA (CVD), annealing and dry-etching. The unit is suitable for a wide range of applications including 3D capacitor fabrication, via hole fill, metallization, etching of rigid and flexible substrates, and ultra-smooth surface etching. TEL Unity II is designed for single-wafer etching, ashers and outside-in-sequence deposition. It features an automated load lock machine, load monitoring, and process control. The etcher / asher tool is designed to provide stable process control and improved process yield with a wide range of materials including polyimide, polyethylene terephthalate, metals, and silica-based dielectric materials. Its advanced planning and testing capabilities, including thin film mass monitoring, uniformity assessment, and sample target etching with variable geometries help ensure process optimization. The gas-phase reaction chamber in TOKYO ELECTRON Unity II etcher / asher asset is operated with a dynamic pressure control to enable flexibility in the process. The chamber's Z-direction wafer flow design allows for a range of complex etching operations that use In-line and Coulombic self-bias (CSB) techniques. The chamber is also equipped with in-line reaction monitors to monitor the etching activity and reaction conditions. Unity II etcher / asher model also includes sophisticated graphics processing software and vacuum chamber control systems to facilitate process optimization, reduce tool downtime and improve equipment continuity for multi-wafer operations. Additionally, the system boasts a wide range of safety features such as redundant PID control and choice of RF or microwave network. TEL / TOKYO ELECTRON Unity II etcher / asher unit is a precision tool for device fabrication and is designed for continuous, reliable operation. With its advanced features and robust engineering, the etcher / asher machine enables fabrication of even extremely complex structures with atomic scale control and high uniformity. It is an ideal choice for rapidly producing high-performance semiconductor components with close tolerance requirements at production speeds.
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