Used TEL / TOKYO ELECTRON Unity IIe 655PP #293793647 for sale

ID: 293793647
Wafer Size: 6"
Vintage: 1996
Oxide etcher, 6" Wafer type: Flat (7) Gas lines Gases: CF4, CHF3, Ar, N2 DAIHEN MFG-20SA3 RF Generator FUJIKIN Manual valve (3) MILLIPORE WG2FT1RR2 Filters (2) VERIFLO SQ60502PFSMM Regulators VERIFLO SQ140E502PFSMM Regulator KURODA B35-2G Regulator NKS Pressure gauge NAGANO KEIKI CB14 Pressure switch Pneumatic valve: CKD AVB21-X0038-FL Vacuum valve FUJIKIN General protective valve VAT 26332-KA71-1001/345 Isolation valve Gas box: Size: 100 Φ Range: 100 CFM 1996 vintage.
TEL / TOKYO ELECTRON Unity IIe 655PP is an advanced etcher/asher equipment designed for high-performance semiconductor processing applications. This cutting-edge tool combines precision etching and ashing capabilities to provide superior process control and performance for advanced semiconductor device fabrication. With a focus on productivity, reliability, and flexibility, TEL Unity IIe 655PP offers a comprehensive solution for the most demanding etch and ash processes. One of the key features of TOKYO ELECTRON Unity IIe 655PP is its plasma etching capability, which is crucial for creating precise patterns and structures on semiconductor wafers. The system utilizes a high-density plasma source to generate a reactive plasma that can selectively etch materials with high precision and uniformity. This enables the fabrication of intricate device structures with sub-micron feature sizes, essential for the production of advanced integrated circuits. In addition to its etching capabilities, Unity IIe 655PP also offers ashing functionality for removing organic and inorganic contaminants from wafer surfaces. Ashing is a critical process step in semiconductor manufacturing, as it helps ensure the cleanliness and integrity of device structures. The unit is equipped with a dedicated ashing chamber and gas delivery machine, allowing for efficient removal of contamination without damaging the underlying materials. TEL / TOKYO ELECTRON Unity IIe 655PP features a robust process chamber with advanced gas distribution and control systems to optimize etch and ash performance. The tool is capable of handling a wide range of process gases, including fluorine-based chemistries for selective etching and oxygen-based chemistries for ashing applications. Precise control over gas flow rates, pressure, and temperature ensures consistent process results and reproducibility across multiple wafers. Moreover, TEL Unity IIe 655PP incorporates advanced process monitoring and control capabilities to enhance process control and stability. Real-time endpoint detection systems allow for precise control of etch and ash rates, enabling accurate process termination and reducing process variability. Integrated process data logging and analysis tools provide valuable insights into process performance and enable process optimization for improved yield and device performance. The asset is designed with versatility and scalability in mind, featuring a modular architecture that allows for easy integration of additional process modules and upgrades. This flexibility enables customization of the model to meet specific process requirements and adapt to changing technology nodes in semiconductor manufacturing. TOKYO ELECTRON Unity IIe 655PP is compatible with a wide range of wafer sizes and materials, making it suitable for a diverse range of application requirements. In conclusion, Unity IIe 655PP is a state-of-the-art etcher/asher equipment that combines precision, reliability, and flexibility to deliver exceptional process performance for advanced semiconductor manufacturing. With its advanced plasma etching and ashing capabilities, robust process chamber design, and integrated process monitoring and control features, TEL / TOKYO ELECTRON Unity IIe 655PP is an ideal solution for semiconductor fabs seeking to achieve high-quality, high-yield device fabrication.
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