Used TEL / TOKYO ELECTRON Unity IIe 844DD #9377254 for sale

TEL / TOKYO ELECTRON Unity IIe 844DD
ID: 9377254
Wafer Size: 8"
Vintage: 1998
Etcher, 8" 1998 vintage.
TEL / TOKYO ELECTRON Unity IIe 844DD is a high-speed, medium-to-large capacity batch etching and ashing equipment, designed to fulfill the needs of research and small and medium production facilities. The Unity IIe is equipped with a photoresist, spacer etching, and CMP etching/ashing chamber, allowing for the processing of substrates with sizes up to 8 inches (200mm) in diameter. Direct viewing of the substrate inside the chamber is possible with the built-in CCD camera system. Additional features of the Unity IIe include a two-stage output, simultaneous etch/ash processing, and heated EBR. The Unity IIe is driven by a 15.1-inch touch panel controller, equipped with TEL U-SERIES multi-memory unit. This machine is able to store up to eight hundred recipes and ten hundred programs. For enhanced productivity, the controller allows for remote control via web browser. The Unity IIe offers high performance as a result of its powerful source schematic construction, multi-memory tool, two-stage output inversion, and EBR control feature. Source schematic construction allows for stable process capabilities, while the multi-memory asset provides high-speed memory write operations. The two-stage output inverter increases particle collection performance, and the EBR control feature expands process recipes. In terms of safety, the Unity IIe is designed to meet the strict requirements set forth in FPD safety class 2. The model integrates a gas sensor, fire extinguisher, and automatic pressure stop, among other safety measures. Overall, TEL Unity IIe 844DD is a high-performance etching and ashing equipment, designed to provide reliable, high-precision processing for research and production facilities. With its high-speed operation, built-in CCD camera system, advanced safety features, and efficient source schematic constructions, the Unity IIe is an ideal tool for precise microetching, substrate etching, and CMP etching/ashing.
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