Used TEL / TOKYO ELECTRON Unity IIe 85 DPATC #9091881 for sale
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ID: 9091881
Wafer Size: 6"
Vintage: 1996
Etcher, 6"
Wafer type: Flat-zone
Processing type: Vacuum
Wafer loading type: Normal
(2) Chambers
Mass flow controller:
Gas No / Gas Name / MFC Size (SCCM)
Gas #1 SF6, 200
Gas #2 HE, 1 SLM
Gas #3 O2, 20
Gas #4 AR, 1SLM
Gas #5 CHF3, 100
Gas #6 CF4, 100
Pressure controller V/V:
Item / Make / Model
ISO V/V (PC1), FUJI SEIKI, 6000729
ISO V/V (PC2), FUJI SEIKI, 1616812
APC (PC1), VAT, 61140-PH52
APC (PC2), VAT, 61140-PH52
Gauge:
Unit / Make / Model / Range
Baratron, MKS, 622A02TAB, 2 Torr
Baratron, MKS, 622A02TAB, 2 Torr
Baratron, MKS, 622A11TAE, 10 Torr
Baratron, MKS, 622A01TAE, 1 Torr
System:
Description / Make / Model
Robot, YASKAWA, VS2A
Robot controller, YASKAWA, SRC-II 004
TMP (PC1), SEIKO SEIKI, STP-H751E
TMP controller (PC1), SEIKO SEIKI, STP-H751E
TMP (PC2), EDWARDS, STP-H751E2
TMP controller (PC2), SEIKO SEIKI, STP-H751E
Generator (PC1), DAIHEN, MFG-20SA
Generator (PC2), DAIHEN, MFG-20SA
Matcher (PC1), DAIHEN, MFM-20AS
Matcher controller (PC1)
Matcher (PC2), DAIHEN, MFM-20AS
Matcher controller (PC2)
EPD (PC1)
EPD (PC2)
HDD (Data): HDS728080
AC rack (PCB):
SVA004a
SVA603
MVME162
TVB0002
TVB3101
TVB0008
TC (PCB):
COM
DIO1
DIO2
MAIO
ILK
PC1:
APC
DIO
MAIO
COM
TEMP
PC2:
APC
DIO
MAIO
COM
TEMP
1996 vintage.
TEL / TOKYO ELECTRON Unity IIe 85 DPATC is a plasma-enhanced reactive ion etcher (PE-RIE) designed for use in semiconductor device fabrication and other related industries. The equipment is designed to provide maximum performance, accuracy and repeatability for etching of wafers or other work pieces. The Unity IIe 85 features a precision high-vacuum chamber, a high-capacity throughput transport and an advanced control system. The chamber is coating-resistant and designed for long-term reliability and highly-precise etching. The Unity IIe 85 PE-RIE has a large-capacity, 3-axis transport unit with a maximum temperature of 450°C. This horizontal transportation machine offers precise wafer transport and positioning, maintaining a uniform, constant and repeatable etch rate across the wafer. The chamber also provides precise pressure control, ensuring the process parameters are maintained without any variance. The etch rate can be adjusted in real-time, allowing precise control over the parameters of the etching process. The etching process is automated with the Unity IIe 85, simplifying the process to ensure repeatable and reliable results. The tool is equipped with the Offline Parameters Setup feature which allows the data for each etch process to be inputted and optimized before any wafers are loaded. The etching process is then monitored and adjusted from within the chamber with a real-time monitoring asset that can be monitored both in-chamber as well as remotely. The Unity IIe 85 uses advanced control technology to maintain its high precision and repeatability. The model utilizes an RF generator to create the plasma which is then regulated by a wide range of parameters such as pressure, temperature, gas flow and current. The equipment also utilizes an IIe controller to adjust the inductance of the RF generator. The Unity IIe 85 is an advanced, reliable PE-RIE system designed for use in semiconductor fabrication and related industries. It provides the highest level of performance, accuracy and repeatability and is capable of automated etch processes with real-time monitoring and control, allowing users to achieve the highest level of precision and production throughput.
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