Used TEL / TOKYO ELECTRON Unity IIe 85 DPATC #9091881 for sale

ID: 9091881
Wafer Size: 6"
Vintage: 1996
Etcher, 6" Wafer type: Flat-zone Processing type: Vacuum Wafer loading type: Normal (2) Chambers Mass flow controller: Gas No / Gas Name / MFC Size (SCCM) Gas #1 SF6, 200 Gas #2 HE, 1 SLM Gas #3 O2, 20 Gas #4 AR, 1SLM Gas #5 CHF3, 100 Gas #6 CF4, 100 Pressure controller V/V: Item / Make / Model ISO V/V (PC1), FUJI SEIKI, 6000729 ISO V/V (PC2), FUJI SEIKI, 1616812 APC (PC1), VAT, 61140-PH52 APC (PC2), VAT, 61140-PH52 Gauge: Unit / Make / Model / Range Baratron, MKS, 622A02TAB, 2 Torr Baratron, MKS, 622A02TAB, 2 Torr Baratron, MKS, 622A11TAE, 10 Torr Baratron, MKS, 622A01TAE, 1 Torr System: Description / Make / Model Robot, YASKAWA, VS2A Robot controller, YASKAWA, SRC-II 004 TMP (PC1), SEIKO SEIKI, STP-H751E TMP controller (PC1), SEIKO SEIKI, STP-H751E TMP (PC2), EDWARDS, STP-H751E2 TMP controller (PC2), SEIKO SEIKI, STP-H751E Generator (PC1), DAIHEN, MFG-20SA Generator (PC2), DAIHEN, MFG-20SA Matcher (PC1), DAIHEN, MFM-20AS Matcher controller (PC1) Matcher (PC2), DAIHEN, MFM-20AS Matcher controller (PC2) EPD (PC1) EPD (PC2) HDD (Data): HDS728080 AC rack (PCB): SVA004a SVA603 MVME162 TVB0002 TVB3101 TVB0008 TC (PCB): COM DIO1 DIO2 MAIO ILK PC1: APC DIO MAIO COM TEMP PC2: APC DIO MAIO COM TEMP 1996 vintage.
TEL / TOKYO ELECTRON Unity IIe 85 DPATC is a plasma-enhanced reactive ion etcher (PE-RIE) designed for use in semiconductor device fabrication and other related industries. The equipment is designed to provide maximum performance, accuracy and repeatability for etching of wafers or other work pieces. The Unity IIe 85 features a precision high-vacuum chamber, a high-capacity throughput transport and an advanced control system. The chamber is coating-resistant and designed for long-term reliability and highly-precise etching. The Unity IIe 85 PE-RIE has a large-capacity, 3-axis transport unit with a maximum temperature of 450°C. This horizontal transportation machine offers precise wafer transport and positioning, maintaining a uniform, constant and repeatable etch rate across the wafer. The chamber also provides precise pressure control, ensuring the process parameters are maintained without any variance. The etch rate can be adjusted in real-time, allowing precise control over the parameters of the etching process. The etching process is automated with the Unity IIe 85, simplifying the process to ensure repeatable and reliable results. The tool is equipped with the Offline Parameters Setup feature which allows the data for each etch process to be inputted and optimized before any wafers are loaded. The etching process is then monitored and adjusted from within the chamber with a real-time monitoring asset that can be monitored both in-chamber as well as remotely. The Unity IIe 85 uses advanced control technology to maintain its high precision and repeatability. The model utilizes an RF generator to create the plasma which is then regulated by a wide range of parameters such as pressure, temperature, gas flow and current. The equipment also utilizes an IIe controller to adjust the inductance of the RF generator. The Unity IIe 85 is an advanced, reliable PE-RIE system designed for use in semiconductor fabrication and related industries. It provides the highest level of performance, accuracy and repeatability and is capable of automated etch processes with real-time monitoring and control, allowing users to achieve the highest level of precision and production throughput.
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