Used TEL / TOKYO ELECTRON Unity IIe 855DD #293646425 for sale

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TEL / TOKYO ELECTRON Unity IIe 855DD
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ID: 293646425
Etcher 2000 vintage.
TEL / TOKYO ELECTRON Unity IIe 855DD is a high performance etcher/asher with a three-chamber design. It is equipped with a unique dual-mode etch/ash method, which combines the etching and deposition process in a single step. This method yields high productivity, uniformity, and yields with minimal waste. TEL UNITY IIE 855 DD has a chamber size of 425 x 425 x 200 mm, allowing for a large capacity to process multiple substrates simultaneously. It is equipped with a dual-axis X-Y scanning capability, allowing for exact positioning of etching and deposition. It also has a programmable substrate lift-off mechanism, allowing it to operate with a higher degree of precision when operating at higher speeds. The etcher/asher is also equipped with a range of advanced automation and controls, including automatic wafer loading and unloading, real-time remote monitoring and diagnosis, and a powerful process control algorithm. TOKYO ELECTRON UNITY II E-855DD is capable of automatically generating optimal etch/ash recipes for different applications. Furthermore, it is designed with the capability to work without an etching gas, making it suitable for different types of etching and deposition processes. UNITY II E-855DD has increased safety features such as an environmental monitoring system and a nitrogen inrush protection system, which reduces the risk of etching gas explosions. It also has an automatic cleaning system, eliminating the need for frequent maintenance. TEL UNITY II E- 855DD is designed with a wide process window and a high-efficiency plasma source, making it suitable for both high-throughput etching and high-quality deposition applications. Overall, UNITY II E- 855DD is a powerful and versatile etcher/asher with a host of advanced features. It has a comprehensive range of process control software, automation, and safety features, making it a great choice for high-precision etching and deposition processes. Furthermore, its high-efficiency plasma source and wide process window make it suitable for both high-throughput and high-quality applications.
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