Used TEL / TOKYO ELECTRON Unity IIe 855II #9142650 for sale

TEL / TOKYO ELECTRON Unity IIe 855II is an advanced etching / ashing equipment designed to perform high-accuracy etching and stripping processes of wafers, particularly in the semiconductor and flat panel industries. The system is capable of performing both standard and deep etching operations, with extremely high etching accuracy and reproducibility, optimized for top-of-the-line device fabrication. The unit features an automated host computer interface for easy and intuitive operation and program management. TEL UNITYIIE-855 II includes four independently controlled process chambers working together as one unit for maximum flexibility and efficiency. The vessel design offers power and flexibility for a variety of etching applications. The gas controlling machine provides precise control over beam current, and the dynamic etch rate is optimized for improved speed and accuracy. The Unity IIe comes with a comprehensive process-control software package that automates various etching operations. It offers user selectable etching options, and pre-programmed process library so that the unit can be set up quickly. Data analysis is easy with accurate records of process calculations and throughput data. A built-in graphical user interface gives users access to all basic controls, while the addition of a parameter database manager enables long-term archive of process recipes and database parameters. Other than etching, TOKYO ELECTRON UNITY IIE 855 II tool also provides advanced stripping process capabilities. Its specialized stripping/etching/barrier layer removal processes offer high-accuracy results, with controlled timing and selectivity that can improve tool yields and performance. In conclusion, TEL UNITY IIE 855I I is a highly advanced etching / ashing asset that provides users with an enhanced level of control and precision. Its automated user interface and comprehensive process control software make it easy to operate, while its versatile vessel design and optimized dynamic etch rate provide maximum speed and accuracy. Finally, its specialized stripping capabilities maximizes tool yields and performance, allowing for efficient and accurate fabrication of semiconductor and flat panel devices.