Used TEL / TOKYO ELECTRON Unity IIe 85DD #143996 for sale
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ID: 143996
Dry etcher, 8"
Process: Dry etch, DDA Plasma etching
Software version: 3.60
Loading configuration: Single cassette / Single wafer
Version: VER 3.40 - REV 206 - TIW - 3.50b
(2) Ceramic electrostatic chuck hardwares
(2) He cooling systems
(2) Cassette load lock protection
(2) ENI RF Generators
(2) ENI Special automation matching networks
NESLAB Dual high temperature chiller
Optical wafer orientation system
(2) Optimized chambers for 8" wafer processing
(2) Mechanical robot arms with (2) blades
(2) SEIKO SEIKI Turbo-molecular pumps
Additional EMO for dry pump
Maintenance controller
(2) Direct pressure monitors
Process configuration:
Position / Description / Gases used
Position 1: Cassette chamber 1: N2
Position 2: Cassette chamber 2: N2
Position 3: Transfer chamber 3: N2
Position 4: Process chamber 1: N2, O2, Ar, CF4, C4F6, C4F8, CHF3
Position 5: Process chamber 2: N2, O2, Ar, CF4, C4F6, C4F8, CHF3
Position 6: PA Chamber: N2
Currently warehoused
AC 208 V, 50/60 Hz, 3-Ph, 225 A
1997 vintage.
TEL / TOKYO ELECTRON Unity IIe 85DD is a precision plasma etcher and asher providing advanced processes for manufacturers. It is equipped with a load locked high density plasma source, enabling rapid process start-up and stable high-throughput etch and ash processes. The etcher/asher is driven by TEL high-level E-pack recipe platform, which integrates process recipes with the AUTO-TUNE dielectric etch and Auto-TUNE showerhead processes for optimized dielectric etching and improved transistor performance. TEL Unity IIe 85DD offers a variety of customizable etch and ash processes, including dry etch, dry-release, dry-plasma-etch and over-etch. The dry etch process is a dry etching process with an etch rate of up to 0.2 nm per minute, making it ideal for manufacturing high-performance transistors for DRAMs, flash memory and other high-end integrated circuits. The dry-release process allows for wafer-level release of masking layers through the use of plasma conditions that degrade the bottom layer while performing a push-back on the top layer. The dry-plasma-etch process produces ultra-low-angle etch profiles with aspect ratios below 3, while the over-etch process uses a high source power profile to achieve optimal etch profiles. TOKYO ELECTRON UNITY IIE 85 DD utilizes an advanced gas distribution equipment to accurately control and monitor the etch and ash gases used in the processes. A combination of showerhead and load locked high density plasma sources provides highly uniform ion bombardment across the wafer surface, resulting in uniform etch profiles at higher deposition rates and improved wafer yield. TOKYO ELECTRON Unity IIe 85DD also features an advanced Closed Control Loop System that continuously monitors the etch and ash process conditions, and provides feedback to the recipe control unit for improved process accuracy. In addition, UNITY IIE 85 DD is designed for safe operation and ease of use. The etcher/asher is equipped with a high-resolution, 12 inch touchscreen control panel, as well as 3D tray viewing capability for easy viewing of the etch and ash process results. Unity IIe 85DD includes a comprehensive monitoring machine that continually monitors the process to ensure safe operation, resulting in improved uptime and minimized cleaning times. Overall, TEL / TOKYO ELECTRON UNITY IIE 85 DD is a reliable, versatile plasma etcher and asher that provides optimized high-throughput processes for the manufacturing industry. Its reliable etch and ash processes, customizable gas distribution tool, advanced Closed Control Loop Asset and intuitive user interface make it an ideal choice for small- to medium-scale manufacturing applications.
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