Used TEL / TOKYO ELECTRON Unity IIe SCCM #293627313 for sale

ID: 293627313
Wafer Size: 8"
ICP Etcher, 8".
TEL / TOKYO ELECTRON Unity IIe SCCM (Substrate Confined Chemical Mechanical Polishing system) is a state-of-the-art etcher/asher for use in various semiconductor applications. As its name implies, TEL Unity IIe SCCM incorporates both chemical and mechanical processes in its etching and polishing operations. It is designed to provide industry-leading uniformity in polishing results while supporting the most advanced substrate configurations. TOKYO ELECTRON Unity IIe SCCM is capable of an etching process that uses HF: H2O2 solution (hydrofluoric acid: hydrogen peroxide) to remove substrate material. The process starts with a substrate that is placed in the etching chamber, then a special nozzle sprays a highly-controlled etching solution onto the substrate while under low pressure. The HF: H2O2 solution's relative strength is then changed to adjust the speed at which etching takes place, allowing for extremely precise control over the etching process. Additionally, Unity IIe SCCM also provides mechanical polishing. As part of its integrated CMP (Chemical Mechanical Polishing) platform, TEL / TOKYO ELECTRON Unity IIe SCCM mechanically polishes uneven surfaces of the substrate. This can be done either by using fast-abrasive polishing pads or by using lower-abrasive diamond tools. The process helps produce finer surface morphology and smoother surfaces, allowing for unparalleled accuracy in the manufacturing process. Furthermore, TEL Unity IIe SCCM is designed with various safety features, including temperature monitoring and an automated gas venting system. It also comes with a pressurized system that keeps the interior environment free of contaminants. Additionally, it supports a variety of substrate types, such as silicon, aluminum, and other metals, as well as wide range of substrate sizes. Overall, TOKYO ELECTRON Unity IIe SCCM is an advanced etcher/asher that is capable of highly precise etching and mechanical polishing processes. It offers superior results in substrate processing and is designed with various safety features and a wide range of adaptable substrate types. For these reasons, Unity IIe SCCM is the perfect choice for any type of etching or polishing application.
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