Used TEL / TOKYO ELECTRON Unity ME 85 DRM #293648350 for sale

TEL / TOKYO ELECTRON Unity ME 85 DRM is an advanced etcher/asher designed for use in MEMS/NEMS and advanced packaging applications. It is able to deposit multiple films of different thicknesses for the fabrication of a variety of microelectronics devices, including MEMS and NEMS devices. The Unity ME 85 is a modular equipment that can be easily modified for specific customer requirements, such as additional pressure and temperature control, custom film deposition rates, and more. The system is equipped with a revolutionary digital gas bypass unit, multi-stage temperature control, and a high-frequency power supply. This enables the machine to deliver reliable and repeatable thin film deposition rates and consistent thin film characteristics and surface finishes. The tool is equipped with a ultra-low pressure deposition feature, as well as a large area plasma surface preparation window that permits substrate processing with minimal contamination. The asset also features a gas delivery manifold and electronic module that permits precise control of gas delivery pressure and flow rates. The Unity ME 85 also features a true 4-axis motion control architecture which facilitates multilayer thin film deposition with precision control over film widths and uniformity. In addition, a real-time monitoring model displays both process conditions and product characteristics, allowing operators to respond quickly to changing conditions. One of the most innovative features of the Unity ME 85 is its proprietary thin film etching mode, which allows for precise manipulation of thin films thickness from 10nm to 1000nm. The equipment's patented dual Plasma Source system provides highly contoured surface finish, as well as a high aspect ratio when etching into difficult materials. The unit is also equipped with a film scrubber machine which ensures that the etch product is completely free from any dust particles that might be present. The Unity ME 85 provides an ideal solution for advanced packaging applications, offering high throughput and process repeatability over a wide range of substrates and materials. The tool is also designed to be compliant with SEMI and ATRM standards, ensuring compatibility with a wide range of thin film processes.