Used TOK TCA-3400 #9142656 for sale

TOK TCA-3400 is an automatic etching and ashing equipment designed for precise removal of material from a variety of microelectronic substrates. This state-of-the-art system features the latest technology for etching and ashing processes. TCA-3400 is capable of performing a wide range of etching and ashing processes on substrates up to 8"x8" in size. The unit features a high-accuracy temperature control and precise fluence regulation, ensuring repeatable results with high precision. It also offers features such as: temperature regulation, high speed operation, contamination-free chamber design, sample and substrate cooling systems and a large range of etching and ashing chemistries. TOK TCA-3400 is designed with two independent process chambers, one for etching and one for ashing. Both of these chambers are equipped with fast-acting heating elements, ensuring quick temperature control and high process precision. These chambers are also shielded from contamination, ensuring that the process conditions remain consistent and clean. The etching chamber is designed to provide several different etching chemistries. This machine supports Inductively Coupled Plasma (ICP) and Reactive Ion Etching (RIE) processes. Both of these process chemistries make use of cool plasma which allows for etching with minimal substrate distortion. The RIE process allows for precise depth control and higher etching rates than the more traditional wet etching process. The ashing chamber is capable of utilizing wet and dry ashing techniques. The wet ashing technique uses a highly reactive etchant solution which oxidizes the substrate's surface leaving behind a thin film. This thin film provides protection from further etching or deposition. The dry ashing technique is effective in removing residues from delicate substrates and can be used to create intricate patterns or nanostructures. TCA-3400 is ideal for materials such as silicon, GaAs, and various polymers. The tool offers a user-friendly interface and can be easily programmed for customized etching and ashing processes. With this asset, users can expect repeatable and precise results, even with high throughput applications.