Used TRIKON / AVIZA Celsior FXP #293767264 for sale
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ID: 293767264
Wafer Size: 8"
Vintage: 2004
Atomic Layer Deposition (ALD) system, 8"
(2) 002-7560-03 Load ports
BROOKS AUTOMATION 003-1600-25 Mainframe robot
BROOKS AUTOMATION 002-7090-04 ATM Robot
(2) UPS
MKS 450 Ozone monitor
EMO Guard ring
Smoke detector
Platform type: Centura II Frame
Process: Oxide etch
Wafer shape: SNNF
Position / Chamber type:
A / Oxide etch (eMax)
B / Oxide etch (eMax)
C / Oxide etch (eMax)
D / Oxide etch (eMax)
F / Orienter
Chamber A, B, C and D:
Process kit
Liner door
Ceramic ESC
Dual magnet
Baratron guage: 1 Torr
Liner: Standard magnet type
EPD: Hot pack
Gas injector
ALCATEL / ADIXEN / PFEIFFER ATH 1600M Turbo pump
0010-11239 HV Module
Gate valve type: Pendium
0010-30686 Match
ENI OEM-28B Generator
Gas delivery options:
Standard component
VERIFLO Valve
MKS 872 Transducer
VERIFLO SQ2 Regulator
MYKROLIS Filter
AERA MFC FC-D980C
Gas panel:
Pallet A and B:
Line / Gas / MFC Size
1 / 1.3 C4F6 / 50 SCCM
2 / C4F8 / 50 SCCM
3 / CO / 500 SCCM
4 / CH2F2 / 50 SCCM
5 / O2 / 50 SCCM
6 / N2 / 300 SCCM
7 / O2 / 2000 SCCM
8 / CF4 / 300 SCCM
9 / CHF3 / 200 SCCM
10 / AR / 1000 SCCM
Pallet C and D:
Line / Gas / MFC Size
1 / H2 / 500 SCCM
2 / NH3 / 500 SCCM
3 / CO / 500 SCCM
4 / CH2F2 / 50 SCCM
5 / O2 / 50 SCCM
6 / N2 / 300 SCCM
7 / O2 / 2000 SCCM
8 / CF4 / 300 SCCM
9 / CHF3 / 200 SCCM
10 / AR / 1000 SCCM
Gas panel features:
Top feed multi line drop hook up
VME II Gas panel controller
Loadlock / Cassette options:
WBLL With auto-rotation
UNIVERSAL Loadlock platform
STANDARD Cassette type supported
KALREZ Loadlock slit valve oring type
Integrated cassette sensor
Transfer chamber options:
Manual lid hoist
Centura VHP+ Robot
AL Blade
Bottom loadlock vent
System controller:
Controller type: 66"
Controller electrical interface: Bottom feed
Top controller exhaust
Controller cover
No adaptor for SECS Port 25-Position
No exhaust duct
No controller IO Interface
No 3-Way switch box
AC Rack:
GFI: 100 mA
AC Rack type: Pri/Sec AC Generator rack, 66"
No UPS
Generator rack:
RF On indicator
No RF Generator rack plexiglas cover
Generator rack water manifold
2004 vintage.
TRIKON / AVIZA Celsior FXP is a sophisticated etcher/asher equipment designed for advanced semiconductor fabrication processes. This tool combines the capabilities of both etching and ashing in a single platform, offering precise control over process parameters for high-performance device manufacturing. AVIZA Celsior FXP utilizes advanced plasma technology to etch and remove unwanted materials from semiconductor substrates with exceptional precision and uniformity. The system features a versatile process chamber equipped with multiple gas inlets, RF power sources, and temperature control capabilities to tailor the etching/ashing process according to specific requirements. Key features of TRIKON Celsior FXP include: 1. Plasma Etching Capabilities: The unit can perform isotropic or anisotropic etching processes to create intricate patterns on semiconductor wafers. The plasma source generates reactive species that chemically react with the substrate surface, selectively removing material layers to define device features with sub-micron resolution. 2. Ashing Functionality: In addition to etching, Celsior FXP can also be used for asher applications, which involve removing photoresist and other organic contaminants from the wafer surface. The machine's ashing capabilities ensure clean and residue-free surfaces, critical for subsequent processing steps in the semiconductor manufacturing flow. 3. Multiple Process Options: TRIKON / AVIZA Celsior FXP supports a wide range of process gases, including fluorine-based chemistries for silicon oxide etching, chlorine-based gases for metal etching, and oxygen-based plasmas for organic material removal. This flexibility enables users to select the optimal chemistry for specific device structures and material compositions. 4. Uniformity and Selectivity: The tool delivers excellent uniformity across the wafer surface, ensuring consistent etch rates and feature sizes from edge to center. Moreover, AVIZA Celsior FXP offers high selectivity between different material layers, enabling precise control over etch depths and profiles without damaging underlying structures. 5. Advanced Control and Monitoring: TRIKON Celsior FXP is equipped with a sophisticated process control asset that enables real-time monitoring of key parameters such as gas flow rates, chamber pressure, RF power levels, and temperature settings. This level of control allows operators to optimize process conditions for maximum yield and device performance. 6. Vacuum Chamber Design: Celsior FXP features a high-vacuum process chamber with advanced pumping systems to create and maintain the desired plasma conditions. The chamber design minimizes particle contamination and ensures a clean processing environment for high-purity device fabrication. 7. Scalability and Integration: TRIKON / AVIZA Celsior FXP can be integrated into cluster tools or multi-chamber systems for seamless wafer processing workflows. Its modular design facilitates scalability to meet evolving production demands and enables easy maintenance and serviceability. In summary, AVIZA Celsior FXP is a state-of-the-art etcher/asher model that offers precise control, reliability, and versatility for semiconductor manufacturing applications. Its advanced plasma technology, process flexibility, and advanced control features make it an indispensable tool for creating next-generation semiconductor devices with superior device performance and yield.
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