Used TRION Phantom RIE ICP #293808761 for sale

TRION Phantom RIE ICP (Reactive Ion Etcher/Inductively Coupled Plasma) is a state-of-the-art plasma processing equipment designed for etching and ashing applications in the semiconductor, MEMS (Micro-Electro-Mechanical Systems), and optics industries. This versatile tool offers high-performance plasma etching capabilities for a wide range of materials, including silicon, silicon dioxide, III-V compounds, metals, and dielectrics. At the heart of Phantom RIE ICP system is its inductively coupled plasma (ICP) source, which generates a highly energetic and uniform plasma that can effectively etch materials with high selectivity and anisotropy. The ICP source operates at radio frequency (RF) frequencies, typically in the range of 13.56 MHz, to efficiently dissociate process gases into reactive species and create a controlled plasma environment for precise material removal. TRION Phantom RIE ICP unit also features a reactive ion etching (RIE) chamber with a robust vacuum machine that enables precise control of process parameters such as pressure, gas flow rates, and temperature. The chamber is equipped with a high-power RF bias source that can be modulated to control ion energy and directionality, allowing for tailored etching profiles and selectivity. One of the key advantages of Phantom RIE ICP tool is its advanced process control capabilities, which enable users to achieve high process repeatability and uniformity across large wafer sizes. The asset is equipped with advanced endpoint detection techniques, such as optical emission spectroscopy (OES) and interferometry, to monitor the progress of the etching process in real-time and ensure accurate endpoint detection. TRION Phantom RIE ICP model also offers a range of gas delivery options, including mass flow controllers (MFCs) and gas mixing capabilities, to support a wide variety of etching chemistries and process recipes. This flexibility allows users to optimize process conditions for specific materials and applications, resulting in excellent etching rates, profile control, and surface finish quality. In addition to its etching capabilities, Phantom RIE ICP equipment can also be configured for plasma ashing applications, where organic contaminants are removed from material surfaces using oxygen or other reactive gases. This makes the system suitable for a variety of cleaning and surface preparation tasks in semiconductor device fabrication and research environments. Overall, TRION Phantom RIE ICP unit is a highly advanced plasma processing tool that offers superior etching and ashing performance, process control, and versatility for a wide range of applications in the semiconductor and related industries. Its combination of advanced plasma sources, process control features, and gas delivery options make it an indispensable tool for achieving precise and reproducible etching and cleaning results on a variety of substrate materials.