Used AXCELIS / FUSION 150 #9384765 for sale

AXCELIS / FUSION 150 is a sophisticated exposure equipment developed by FUSION Technologies Inc., used for various semiconductor fabrication processes. This system is well-suited for applications such as wafer processing, lithography, chemoepitaxy, and MEMS fabrication. This unit offers advanced features to address the stringent needs of today's semiconductor manufacturing industry, providing superior performance and reliability. FUSION 150 is based on an off-axis, patterned-field illumination (PFIL) platform. This unique platform enables exposure of non-symmetrical features with high precision. The machine has imaging and illumination resolutions of 1.4 and 14 nm, respectively. It utilizes an automated alignment tool with a range of image-processing algorithms to ensure precise and repeatable field patterning. The asset also allows for fine grained exposure control and adjustment. The model is fully integrated with advanced metrology and advanced motion control features to guarantee high throughput and precise results. Its high-resolution toolkit allows for accurate overlay and repeatability, while its metrology capabilities ensure even wafer exposure. It supports a range of programmable field size configurations such as full-field, quadrant, and segment to enable precise repeat positioning and exposure. AXCELIS 150 is very energy efficient and includes a high-performance energy management equipment with integrated power and cooling units. All of the necessary power and cooling components are integrated into the system for optimal energy efficiency and reliability. The unit is compliant with global safety and regulatory requirements, and is designed for reliability and long-term operation. It is also built with an intuitive user interface, allowing for easy and intuitive operation. Additionally, it has a robust machine configuration which allows for rapid and easy tool integration and execution. 150 has various features including automatic alignment, integrated field patterning, complete automation, and high energy efficiency. It is an ideal choice for high-precision exposure processes and cost-effective wafer production. Its advanced features and reliable operation make it highly suitable for semiconductor production requirements.