Used AXCELIS / FUSION 200 PC #9250798 for sale

AXCELIS / FUSION 200 PC is an automated lithography exposure equipment, designed to provide reliable semiconductor fabrication capabilities with flexible setup and operation. The system has a Dual Chamber design, featuring two independent process chambers within a single unit, one for developing resist and one for exposing and patterning the resist. This feature enables high throughput of photoresist and substrate processing, without sacrifice of process uniformity or accuracy. The Dual Chamber design also has the added benefit of reducing cross-contamination risk by preventing the transfer of chemical pollutants or other contaminants from one chamber to the other. FUSION 200 PC is capable of performing a variety of process steps, including spincoat, bake, align, expose, post-exposure bake, develop, and rinse. The unit also features an advanced automated alignment technology, which uses optics to position and map patterns on substrates. This technology improves resolution and accuracy while also drastically reducing user input time. Additionally, AXCELIS 200 PC incorporates computerized wafer handling capabilities, allowing for accurate substrate transfer and precise positioning on the machine's substrate handling stage, and reducing transfer time. 200 PC has a repeatable imaging chamber camera tool, as well as a built-in viewing port, which facilitates the alignment of substrates and critical patterning. The asset has a modular construction and an ergonomic design to improve user access and mobility while enhancing maintenance ease. AXCELIS / FUSION 200 PC has a user-friendly On-board Process Control Model (OPCS) that allows for seamless integration and full integration of equipment process controls. The OPCS is designed to monitor process parameters and minimize user intervention during system operation. FUSION 200 PC is capable of running small parts, providing overall increased unit up-time. The machine also offers repeatability and high throughput for single wafers. Furthermore, its automated substrate handling technology reduces manual setup time while optimizing tool yield. The asset is well-suited for both prototype and small-scale production applications.