Used AXCELIS / FUSION M 150 #9095706 for sale

AXCELIS / FUSION M 150 is a critical-dimension (CD) metrology exposure equipment designed and developed to ensure reproducibility of lithographic exposures for semiconductor wafer testing and processing. This system uses advanced laser-based illumination optics to produce uniform and stable exposure profiles. It features low entry dose levels, precision CD measurements, and highly automated operation. FUSION M 150 is powered by an intuitive graphical user interface (GUI) and graphic object-oriented tools that allow for flexible exposure recipes. An efficient algorithm enables accurate CD control of patterned wafer topography with traceable quality control results. As a result, it offers improved and faster average time-per-wafer throughput. AXCELIS M150 also offers improved uniformity and stability for lower pattern defects, and higher yield rates. This unit employs an advanced adaptive DoE (Design of Experiments) based on volumetric model reconstruction to achieve optimal exposure conditions. It is equipped with a dual-source I-line projection illuminator and RGB triangle metrology machine for precisely measuring CD on the wafer surface. The powerful I-line illuminator delivers greater throughput and higher resolutions of up to 1.1 um. In replacement of the traditional reticle stage, the positioning accuracy is improved with the introduction of the high-speed single-axis piezo stage. The Piezo stage is also capable of accurate scanning, allowing for low-cost overlays. AXCELIS / FUSION M150 has direct access to a robust tool database to facilitate fast and repeatable process recommissioning. It also offers enhanced user experience with Auto Tool Calibration. This feature ensures accurate process results and ultimately increases wafer throughput. It also features extended process development through a wide range of metrology and analysis tools, including a powerful optical microscope, overlay analysis tool, and imaging software capable of imaging angles between 0 and 360 degrees. In addition, FUSION M150 is equipped with a variety of quality control features to maintain a consistent level of production quality. It has an advanced tool-synchronized OPC Metrology for improved accuracy control, improved resolution of CD measurements with dynamic and static flat-field correction for clear edge-to-edge printing, a wide variety of focus recipes for cost-effective solutioning, and a high-resolution scanning capability with a large sample size. M150 provides great flexibility, and offers a variety of configurations for optimal performance and metrology results. It is a reliable and cost-effective asset for semiconductor wafer processing, which provides streamlined operation and maximum wafer throughput.