Used AXCELIS / FUSION M 150PC #293619558 for sale

AXCELIS / FUSION M 150PC is an advanced exposure equipment designed for the fabrication of integrated circuits and high-density interconnects. The system is designed to achieve the highest quality, most uniform results in high volume turn-to-turn production. The unit incorporates a multi-wavelength platform that allows for precise alignment of solar cell, circuit and device devices configured to yield the most comprehensive exposure coverage. This exposure therapy offers greater throughput, lower operating costs and improved device electrical performance. The machine includes multiple illumination sources, including a pulsed excimer laser capable of generating exposure wavelengths from both the ultraviolet (UV) and visible light spectrums. This allows for exposure coverage of both complex poly-silicon and small picture elements. The tool is also equipped with a wide range of mask plates and wafer stages, allowing users to quickly and accurately configure desired exposure conditions. This dynamic exposure platform promotes faster layer-to-layer alignment and overlay performance, while delivering an optimized exposure swath. The asset is also designed with tight temperature tolerances. This temperature control helps users achieve consistent and repeatable performance throughout exposure cycles. The model incorporates active air cooling, which helps maintain uniform temperature across the exposures area. The equipment also features advanced software controls. It uses sophisticated algorithms to quickly and accurately configure multi-wavelength exposure platforms and integrate with sophisticated equipment control systems. This allows users to easily adjust exposure parameters in order to deliver the highest quality performance achievable from FUSION M150PC. This system is considered to be one of the most advanced exposure platforms in the industry. It is well-suited for the fabrication of high-density integrated circuits and devices. The unit offers the precise control and uniformity necessary to ensure the highest quality silicon devices and circuits for next-generation applications.