Used AXCELIS / FUSION M 150PC #9226631 for sale

AXCELIS / FUSION M 150PC is an exposure equipment manufactured by FUSION Technologies. It is a lithography system used to create patterns on integrated circuit (IC) wafers and substrates. The unit is capable of processing wafers up to 150mm in size (6 inches), with a pattern depth resolution of up to 5 nanometers. The machine is characterized by its advanced high-resolution capabilities, high throughput, and ease of use. The tool features a high-resolution, high-throughput stepper scanning asset, able to process 6" wafers at up to 350 wafers/hr. Using Asurf software, the model is programmed for a wide range of exposure patterns and substrate materials, allowing the user to customize the process for the desired wafer size and production needs. The equipment also features a long-life continuous-wave laser diode, able to support patterning of substrates up to 10nm. FUSION M150PC also comes equipped with a high-performance electron beam source. This beam source allows the user to achieve pattern depths down to 5 nm, with beam current ranges up to 3 amps/cm2 and exposure dose up to 20 mrad/cm2. The system also offers integrated real time defect detection, allowing optimal productivity by enabling the user to quickly identify any defects on the substrate. The unit is built upon an ergonomic design and easy to use software, making it easy to integrate into existing processes and training requirements. The machine is powered by AXCELIS OneCET software and AXCELIS / FUSION Interlock Controller, providing efficient wafer process monitoring and control. The tool is compliant with ISO, SEMI, and OHSAS standards for safety, quality, and environmental standards. Moreover, the asset is subjected to regular maintenance and updates in order to meet industry standards and safety regulations, ensuring optimal performance throughout its lifespan. All in all, AXCELIS M 150 PC is a high-performance exposure model designed for the highest precision and clarity in pattern definitions and substrate material types. Offering high-speed throughput and accurate patterning, the equipment provides the user with great flexibility and the ability to continually adjust for optimal performance. Combined with optional beam tracing packages and real time defect detection, the system is an excellent solution for IC production and other related processes.