Used AXCELIS / FUSION M 150PC #9250096 for sale

AXCELIS / FUSION M 150PC Exposure Equipment is an advanced, direct-view wafer exposure tool designed for use in the production of ICs. The system is suitable for use in quantity production of high-density devices with sub-micron feature sizes. The unit is based on a linear motor machine that allows for accurate positioning and loading/unloading of substrates. The tool is capable of exposing up to 150mm substrates at a 200X reduction with a depth of focus of 30 microns. The asset offers a suite of features designed to reduce contamination and increase accuracy. The model's direct-view capability uses an integrated long life, sealed-lens projection equipment with a closed glass canopy, which ensures a clean, dust-free environment. It is also equipped with an integrated laser interferometer, which provides precise substrate positioning and control of substrate tilt. The system's optical unit utilizes a coating-free dry projection lens and a series of optical bandpass filters that enable the generation of fine line and sub-micron feature sizes. Additionally, the machine is equipped with a motorized aligner which can be used to quickly and accurately align substrates with a precision of < 0.2um. The tool's motorized wafer-handling asset offers both single- and dual-substrate processing and includes six-sigma capability. The model also has a fully-automated, automated substrate mapping function to ensure repeatable substrate processing. FUSION M150PC is an efficient and reliable equipment that is designed for long-term, cost effective production. The system's specialized programming ensures fast and stable throughput, with production rates up to 12 cycles per hour. The unit is designed with a modular configuration, allowing for flexibility and upgrades when needed. The machine also offers network connectivity for remote monitoring and control, and is compatible with a variety of host computers, operating systems, and software. AXCELIS M 150 PC Exposure Tool provides advanced, precision exposure capabilities for IC fabrication processes. With its comprehensive array of features and automation, the asset is well suited for high-density device production and ensuring accurate and repeatable results.