Used AXCELIS / FUSION M 150PCU #9043936 for sale

AXCELIS / FUSION M 150PCU Ion Implantation Equipment is a state-of-the-art and reliable equipment for maximum process flexibility and throughput for implantation. It is an advanced technology integrated ion implanter system, suitable for a wide range of device processes. It provides precision and superior scan control. This exposure unit consists of a source chamber, scanner, and a wafer transfer machine. The source chamber is equipped with a 15EkV doping and a 20kV anneal gun. It has an 8 segment electrostatic-scanner for precise implant control. The vertical axis of the scanner is computer controlled. The wafer transfer tool is designed so that wafers can be loaded and unloaded from the asset without halting the model operation. It is also equipped with an automatic wafer loading and unloading module. The equipment is controlled by a Windows-based computer system, which allows for easier programming of implantation recipes and more precise implantation control. The unit also has a real-time feedback loop, which helps to control the dose and the profile of the implant. The machine allows for precision and repeatability even with small dose differences. FUSION M 150PCU provides reliable, repeatable, and high performance implantation. It uses advanced ion source control techniques and advanced beam and substrate control to ensure high productivity. The user interface consists of a large touchscreen color monitor and a graphical programming language. This makes programming and changing recipes quick and easy. The tool is also capable of handling small substrate sizes and different plasma processes such as low energy implants. The asset has a multistage duty cycle which allows for optimal dopant usage and minimal model charging. Additionally, it features maximal process flexibility, allowing users to efficiently manage a variety of implantation processes with its quick cycle times. AXCELIS M 150 PCU offers high performance, flexible, and efficient implantation and annealing capabilities for a wide variety of devices and substrates. It contains advanced beam control technology and an intuitive user interface for faster and more accurate implementation of implantation recipes. It has superior repeatable performance to enhance yields and performance for maximum reliability.