Used AXCELIS / FUSION M 200 PCU #9314174 for sale

ID: 9314174
Wafer Size: 8"
UV Stabilizer / Bake system, 8" Chamber.
FUSION™ AXCELIS / FUSION M 200 PCU exposure equipment is an advanced and highly efficient substrate exposure system for advanced transistor technologies. It combines the latest process technologies with a highly adaptable substrate handling platform to permit a wide range of device fabrication processes to be processed. FUSION M200PCU unit includes a fully integrated opto-mechanical machine with a 4-point substrate handling capability. It also features an advanced imaging and alignment configuration with the capability of achieving very accurate alignment. Moreover, the tool gives users the option of accommodating up to 7 different substrate causes to be used. The asset relies on a dual-gun, radio frequency (RF) based electron beam evaporation. This process ensures the delivery of consistent layer thicknesses as well as excellent repeatability. The RF source also works to minimize toxic volatile organic compounds (VOC) while still giving excellent results. The model offers users a variety of benefits such as the ability to expose large-area substrates quickly and without distortion; the ability to create multiple layers of different materials; and the provision of a variety of exposure techniques including multi-axis, dynamic and stepped resolution. It also lets users customize exposure parameters, improve alignment accuracy, reduce substrate and material handling times, reduce heat stress and reduce mask contamination. With a robust design capable of producing high-quality patterns, AXCELIS M200 PCU is an ideal substrate exposure equipment for a wide range of substrate and device applications including producing advanced transistors such as field effect transistors (FETs), metal-oxide-semiconductor (MOS) devices, and surface acoustic wave (SAW) resonators. Additionally, it can be used for a variety of deposition tasks such as CMP processing, dielectric etching, gate deposition, spacer deposition, and barrier/liner deposition processes.
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