Used AXCELIS / FUSION PS3 #9240662 for sale
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ID: 9240662
Wafer Size: 12"
UV Cure system, 12"
Process: UVH
PM1: HS (Missing PC, PS)
PM2.
AXCELIS / FUSION PS3 is an exposure equipment designed to provide industry standard lithographic exposure capabilities. This system is the successor of FUSION platform, which offers several significant upgrades and improvements. This unit utilizes leading-edge laser scanning technology to provide superior resolution and very tight, repeatable patterning. It has adjustable feature sizes ranging from 4 microns up to 10 microns. It also has a high power laser with an output power of up to 2000 watts, allowing for faster exposures as well as higher throughput. The machine has a large, fine, mechanical bridge to cover a wide range of exposure fields, up to 12 inches. This bridge comes with a variety of adjustable holders for lithographic masks including BGA, LGA and specialty masks. The tool also features several lid types and sizes to accommodate larger substrates. FUSION PS3 asset features advanced nozzle designs that are designed with a focus on improved dimension accuracy and minimal vibration. This ensures a superior substrate patterning accuracy, while also providing a safer environment with lower noise levels. Additionally, the model also features a wide variety of exposure options, including focused beam, reflective and overlay options. This variety gives users the ability to accurately match their exposure needs, while also improving speed and throughput. Last, but not least, this equipment also comes with a comprehensive suite of software tools to maximize its capabilities. The bundled software provides analysis capabilities that let users identify and remove pattern defects while performing projection matches with the design data. It also has automatic defect recognition capabilities that help to ensure the quality of the substrate patterns, reducing the risk of costly errors and re-work. Overall, AXCELIS PS 3 is a powerful and reliable system designed for modern lithographic exposure needs. This unit could be an ideal solution for processes such as advanced packaging, high pin-count device fabrication and biomedical device manufacturing.
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