Used ELECTRON VISION / AMAT / APPLIED MATERIALS 3C-PM #28671 for sale

ID: 28671
Wafer Size: 12"
Vintage: 2002
Electron beam cure tool, 12" Loaders: Asyst dual SMIF-300FL Prealigner: PRI/Equipe transfer robot and PR300B-CE Turbo pumped main chamber High voltage power supply: Bertan 105 1Kw 208V, 3 Phase 2002 vintage.
ELECTRON VISION / AMAT / APPLIED MATERIALS 3C-PM is an exposure equipment designed to support advanced optical lithography applications. This system enables high photographic resolution and reduced X-Y stage motion. AMAT 3C-PM consists of a critical alignment stage designed to provide precision alignment during exposure and a high accuracy optical imaging unit. ELECTRON VISION 3C-PM supports very high resolution feature control with sub-resolution alignment of patterns, as well as die-to-die mask alignment for ultra-high grade performance. The machine includes an advanced imaging microscope giving fully pre-compensated projection and field views of the pin grid array (PGA) stage. There is also feature recognition and gap adjustment capability. 3C-PM offers high throughput applications with a die size of up to 8 inches for maximum yield. It controls all lithography processes including coating, pattern inspection, exposure, and mask alignment. Each APPLIED MATERIALS 3C-PM tool has an integrated defect inspection asset. ELECTRON VISION / AMAT / APPLIED MATERIALS 3C-PM has an on-board motor control to guarantee high positional accuracy. It features a highly accurate vacuum/pressure clamping model to ensure a tight fit between die sides and maximize process yield. AMAT 3C-PM is designed to be a highly flexible equipment that provides dual-side imaging and a wide range of exposure parameters to accommodate diverse product requirements. It allows photomasks to be changed quickly while maintaining consistent imaging conditions. The system is capable of independently controlling the intensity of each LED or Laser array and thereby ensuring a uniform exposure throughout the entire substrate surface ELECTRON VISION 3C-PM is specially designed for multi-layer lithography with a fully programmable optics correction unit that provides efficient and accurate correction for mask misalignment. It also offers advanced control of laser energy and permits dynamic laser exposure control. Additionally, the machine is equipped with a comprehensive alignment tool for manual and automated pattern transfer to substrates. 3C-PM is a cost-effective, reliable, and adaptable exposure asset providing advanced optical lithography solutions. It is designed to simplify the process of high-resolution and high-quality device patterns with low material costs and excellent reliability. This model gives manufacturers maximum control over the lithography process and enables them to produce superior quality devices in shorter times.
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